June 3 @ 10:00 am - 11:00 am CDT Stacked vs. Staggered Microvias June 3 @ 10:00 am - 11:00 am CDT Stacked vs. Staggered Microvias Meeting
June 3 @ 11:00 am - 12:00 pm CDT Thin Dielectric Skew Project Kickoff June 3 @ 11:00 am - 12:00 pm CDT Thin Dielectric Skew Project Kickoff Explore New Project on Thin Dielectric Weave Skew
June 3 @ 12:00 pm - 1:00 pm CDT Harsh Use Alloy Evaluations Project Call June 3 @ 12:00 pm - 1:00 pm CDT Harsh Use Alloy Evaluations Project Call Periodic Project Call
June 4 @ 9:00 am - 10:00 am CDT Reflow Cycle Via Reliability Impact Project Call June 4 @ 9:00 am - 10:00 am CDT Reflow Cycle Via Reliability Impact Project Call Reflow Cycle Via Reliability Impact Project Call
June 4 @ 10:00 am - 11:00 am CDT Inner Layer Copper Balancing Phase 2 June 4 @ 10:00 am - 11:00 am CDT Inner Layer Copper Balancing Phase 2 Inner Layer Copper Balancing Phase 2
June 4 @ 7:00 pm - 8:00 pm CDT Investigate New Test Methods for Copper Adhesion Project Call June 4 @ 7:00 pm - 8:00 pm CDT Investigate New Test Methods for Copper Adhesion Project Call Investigate New Test Methods for Copper Adhesion Project Call
June 5 @ 10:00 am - 11:00 am CDT What is Good Enough Microvia Reliability? June 5 @ 10:00 am - 11:00 am CDT What is Good Enough Microvia Reliability? Project Call to gauge members interest in this proposed project.
June 5 @ 12:00 pm - 1:00 pm CDT Investigate Electrical Performance of Stacked vs. Staggered Microvias June 5 @ 12:00 pm - 1:00 pm CDT Investigate Electrical Performance of Stacked vs. Staggered Microvias Meeting
June 9 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency June 9 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency Final Finish Layer Deposits for High Frequency
June 10 @ 6:00 pm - 7:00 pm CDT Porosity June 10 @ 6:00 pm - 7:00 pm CDT Porosity Results of our action items
June 11 @ 11:00 am - 12:00 pm CDT Single Surface Finish 2 June 11 @ 11:00 am - 12:00 pm CDT Single Surface Finish 2 Meeting
June 12 @ 10:00 am - 11:00 am CDT ECM-4 June 12 @ 10:00 am - 11:00 am CDT ECM-4 New Idea Project Meeting
June 12 @ 11:00 am - 12:00 pm CDT TCE Materials-Validation of Test Method June 12 @ 11:00 am - 12:00 pm CDT TCE Materials-Validation of Test Method Develop standard TM to measure CTE in x-y direction.
June 12 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis June 12 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis Glass Substrate Reliability Analysis
June 14 @ 8:00 am - 9:00 am CDT Wallace Test Meeting June 14 @ 8:00 am - 9:00 am CDT Wallace Test Meeting Testing Wallace Ables meetings to calendar function.
June 17 @ 11:00 am - 12:00 pm CDT Local Area PWB Warpage – Kick off June 17 @ 11:00 am - 12:00 pm CDT Local Area PWB Warpage – Kick off Meeting
June 18 @ 9:00 am - 10:00 am CDT Better CAF Eq June 18 @ 9:00 am - 10:00 am CDT Better CAF Eq Project update
June 18 @ 10:00 am - 11:00 am CDT SIR Testing meeting June 18 @ 10:00 am - 11:00 am CDT SIR Testing meeting Meeting
June 19 @ 9:00 am - 10:00 am CDT Copper Surface Roughness Model June 19 @ 9:00 am - 10:00 am CDT Copper Surface Roughness Model Signal Integrity Modeling Validation
June 19 @ 10:00 am - 11:00 am CDT Materials #7 meeting June 19 @ 10:00 am - 11:00 am CDT Materials #7 meeting Meeting
June 19 @ 11:00 am - 12:00 pm CDT Stacked vs. Staggered Microvias June 19 @ 11:00 am - 12:00 pm CDT Stacked vs. Staggered Microvias Meeting
June 24 @ 8:00 am - 9:00 am CDT Recurring HDP Staff Call June 24 @ 8:00 am - 9:00 am CDT Recurring HDP Staff Call Weekly Staff Call
June 24 @ 10:00 am - 11:00 am CDT Electrical Performance of Microvias June 24 @ 10:00 am - 11:00 am CDT Electrical Performance of Microvias Meeting
June 25 @ 9:00 am - 10:00 am CDT Reflow Cycle Via Reliability Impact Project Call June 25 @ 9:00 am - 10:00 am CDT Reflow Cycle Via Reliability Impact Project Call Reflow Cycle Via Reliability Impact Project Call
June 25 @ 11:00 am - 12:00 pm CDT Sequential Lamination June 25 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting
June 25 @ 3:00 pm - 4:00 pm CDT Cu Outer Trace Adhesion June 25 @ 3:00 pm - 4:00 pm CDT Cu Outer Trace Adhesion Status of coupon build Data analysis of the trial run
June 26 @ 9:00 am - 10:00 am CDT ECM-4 June 26 @ 9:00 am - 10:00 am CDT ECM-4 HDP Idea Project Meeting
June 26 @ 10:00 am - 11:00 am CDT D-Coupon/IST/CITC Reliability Testing June 26 @ 10:00 am - 11:00 am CDT D-Coupon/IST/CITC Reliability Testing Project Idea Phase
June 26 @ 11:00 am - 12:00 pm CDT Single Surface Finish 2 June 26 @ 11:00 am - 12:00 pm CDT Single Surface Finish 2 Meeting
June 27 @ 11:00 am - 12:00 pm CDT TCE Materials-Validation of Test Method to measure CTE in x-y direction June 27 @ 11:00 am - 12:00 pm CDT TCE Materials-Validation of Test Method to measure CTE in x-y direction Need to validate TM and standardize testing for accurate CTE measurements.
June 30 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency June 30 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency Final Finish Layer Deposits for High Frequency
July 1 @ 8:00 am - 9:00 am Recurring HDP Staff Call July 1 @ 8:00 am - 9:00 am Recurring HDP Staff Call Weekly Staff Call
July 1 @ 12:00 pm - 1:00 pm CDT Harsh Use Alloy Evaluations Project Call July 1 @ 12:00 pm - 1:00 pm CDT Harsh Use Alloy Evaluations Project Call Periodic Project Call
July 2 @ 7:00 pm - 8:00 pm CDT Investigate New Test Methods for Copper Foil Adhesion Project Call July 2 @ 7:00 pm - 8:00 pm CDT Investigate New Test Methods for Copper Foil Adhesion Project Call Investigate New Test Methods for Copper Foil Adhesion Project Call
June 27 @ 11:00 am - 12:00 pm TCE Materials-Validation of Test Method to measure CTE in x-y direction