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Events for May 2021

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Calendar of Events

Calendar of Events
Sunday Monday Tuesday Wednesday Thursday Friday Saturday
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26

10:00am - 11:00am Reliabilioty and Power Cycles telecom

27

10:00am - 11:00am Innerlayer Copper Balancing telecom

1:00pm - 2:00pm Harsh Use Alloy Eval 2

8:00pm - 9:00pm High Speed Hybrid PWB Project Call

28

11:00am - 12:00pm Kick off of Single Surface Finish for Soldered & Compression Contact Pads

3:00pm - 4:00pm Photonic Soldering

4:00pm - 5:00pm PCB Feature Min

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30
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3

10:00am - 11:00am Backdrill Under BGA telecom

4

2:00pm - 3:00pm Board Thickness II

3:00pm - 4:00pm PCB Feature Min.

5

10:00am - 11:00am Materials #6 meeting

11:00am - 12:00pm Thermal Analysis Methodology Evaluation May 5, 2021 project meeting

3:00pm - 4:00pm Photonic Soldering

6

9:00am - 10:00am PFH Technology 2 Project Call

1:00pm - 2:00pm HDP Cu Peel Strength P2 project May 6, 2021 meeting

7

9:00am - 10:00am Effects of Plating Thickness on Cycles To Failure At IST Project Meeting

8
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10

10:00am - 11:00am Reliability and Power Cycles telecom

11

12:00pm - 1:00pm DISC2A

1:00pm - 2:00pm Harsh Use Alloy Eval2 Project Call

12

12:00pm - 1:00pm Single Surface Finish for Soldered & Compression Contact Pads

13
14

10:00am - 11:00am Ultra Low Dk glass Telecom

15
16
17

10:00am - 11:00am ECM2 Project call

18

10:00am - 11:00am CAF Eq

11:00am - 12:00pm Reliability and Power Cycles telecom

3:00pm - 4:00pm PCB Feature Min

19

10:00am - 11:00am Backdrill Under BGA telecom

11:00am - 12:00pm Materials #6 meeting

1:00pm - 2:00pm 20210519 Glass Type Comparison Project meeting of May 19, 2021

20

10:00am - 11:00am Innerlayer Copper Balancing telecom

11:00am - 12:00pm Cu Surface Treatment Vs loss May 20, 2021 project meeting

1:00pm - 2:00pm Cu Peel Strength P2 May 20, 2021 Project meeting

21
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25

10:00am - 2:30pm HDP May 2021 Virtual Member Meeting

8:00pm - 10:30pm HDP May 2021 Virtual Member Meeting Asia

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31
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4

9:00am - 10:00am Effects of Plating Thickness on CTF at IST Project Call

5
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