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Events for July 2021

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Calendar of Events

Calendar of Events
Sunday Monday Tuesday Wednesday Thursday Friday Saturday
27
28

10:00am - 11:00am Reliability and Power Cycles

8:00pm - 9:00pm LVH Lifetime Predictor for TC Project Call

29

1:00pm - 2:00pm Board Thickness II

3:00pm - 4:00pm PCB Feature Miniaturization

30

10:00am - 11:00am Materials #6 meeting

11:00am - 12:00pm Thermal Analysis Methodology Evaluation June 30, 2021 project meeting

12:00pm - 1:00pm Low Ag Alloy Solder paste BGA leg project meeting of June 30, 2021

1

10:00am - 11:00am Single Surface Finish for Soldered & Compression Contact Pads

11:00am - 12:00pm Cu Surface Treatment Vs Loss July 1, 2021 project meeting

1:00pm - 2:00pm Cu Peel Strength July 1, 2021 project meeting

2

11:00am - 12:00pm Backdrill Under BGA telecom

3
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5
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7
8
9

10:00am - 11:00am Ultra-Low Dk Glass Project

10
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12

10:00am - 11:00am Reliability and Power Cycles telecom

13

10:00am - 11:00am Innerlayer Copper Balancing telecom

2:00pm - 3:00pm PCB Feature Min

3:00pm - 4:00pm Photonic Soldering II

14

8:00am - 9:00am DISC2A

11:00am - 12:00pm Thermal Analysis Methodology Assessment July 14, 2021 meeting

12:00pm - 1:00pm Low Ag Alloy Solderpaste July 14, 2021 project meeting

15

11:00am - 12:00pm Cu Foil Surface Treatment vs Loss July 15, 2021 project meeting

1:00pm - 2:00pm Cu Peel Strength Phase 2 July 15, 2021 project meeting

16

9:00am - 10:00am Effects of Plating Thickness on CTF at IST Project Call

11:00am - 12:00pm Backdrill Under BGA telecom

17
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19
20

12:00pm - 1:00pm Harsh Use Alloy Eval Project Review Call

2:00pm - 3:00pm PCB Feature Min

21

7:00pm - 8:00pm Reliability of Wettable Flank in Routable QFN for Automotive Project Call

22

10:00am - 11:00am Single Surface Finish for Soldered & Compression Contact Pads

23

10:00am - 11:00am Ultra-Low Dk Glass Project Review

24
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27

10:00am - 11:00am Better CAF Eq

11:00am - 12:00pm Innerlayer Copper Balancing telecom

2:00pm - 3:00pm PCB Feature Mon

28

8:00am - 9:00am DISC2A

9:00am - 10:00am ECM 2 Project Call

11:00am - 12:00pm Thermal Analysis Methodology Assessment July 28, 2021 project meeting

29

10:00am - 11:00am Materials #6 meeting

11:00am - 12:00pm Cu Surface Treatment vs Loss July 29, 2021 project meeting

1:00pm - 2:00pm Cu Peel Strength July 29, 2021 project meeting

30

10:00am - 11:00am Backdrill Under BGA telecom

31
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