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Latest Project Activity

September 06, 2024

Effects of Plating Thickness on CTF at IST Phase 2

IPC-6012 specification requires a minimum of 0.8 mils of plating in holes for class 3 products. On thicker PWB, this plating thickness may produce occasional problems with plated through hole…

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HDP User Group is a project-oriented industry consortium addressing the integration of new electronics component packaging and interconnect technologies into member company supply chains.

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