Latest Project Activity

March 17, 2022

Innerlayer Copper Balancing

“OEMs are requiring tighter backdrill stub length control at higher signal frequencies with Backdrill targeted under BGA, connectors, and DDR memory modules. Due to changes in localized copper density across…

Member Meetings

Most Recent News

May 10, 2022

High Density Packaging User Group Announces Daikin Membership

High Density Packaging (HDP) User Group is pleased to announce that Daikin America, Inc. (Daikin) has become a member. “Daikin is a world leading manufacturer of […]