Latest Project Activity
December 07, 2021
The project proposal is to investigate the defects and anomalies found in back drilled vias including “resin pull away/non-adhesion”, “no epoxy bond in the bottom of the back drill”, “…
Member Meetings
Most Recent News
November 1, 2021
High Density Packaging (HDP) User Group is pleased to announce that Co-Tech Development (Co-Tech) has become a member. “Listening to the Voice of the Customer, uncovering […]
