BEGIN:VCALENDAR
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PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260609T150000Z
DTEND:20260609T160000Z
DTSTAMP:20260605T152817
CREATED:20260515T124829Z
LAST-MODIFIED:20260515T124829Z
UID:40288-1780999200-1781002800@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-15/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260610T150000Z
DTEND:20260610T160000Z
DTSTAMP:20260605T152817
CREATED:20260401T163431Z
LAST-MODIFIED:20260401T163431Z
UID:39963-1781085600-1781089200@hdpusergroup.org
SUMMARY:Inner Layer Copper Balancing 2
DESCRIPTION:Project Meeting Minutes 
URL:https://hdpusergroup.org/event/inner-layer-copper-balancing-2-8/
CATEGORIES:Inner Layer Copper Balancing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T010000Z
DTEND:20260611T020000Z
DTSTAMP:20260605T152817
CREATED:20260520T011933Z
LAST-MODIFIED:20260520T011933Z
UID:40338-1781121600-1781125200@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-37/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T140000Z
DTEND:20260611T150000Z
DTSTAMP:20260605T152817
CREATED:20260513T142900Z
LAST-MODIFIED:20260513T142900Z
UID:40044-1781168400-1781172000@hdpusergroup.org
SUMMARY:ECM-4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/ecm-4-22/
CATEGORIES:Electro-Chemical Migration 4
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T150000Z
DTEND:20260611T160000Z
DTSTAMP:20260605T152817
CREATED:20260521T141322Z
LAST-MODIFIED:20260521T141322Z
UID:40339-1781172000-1781175600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-21/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T160000Z
DTEND:20260611T170000Z
DTSTAMP:20260605T152817
CREATED:20260521T162633Z
LAST-MODIFIED:20260521T162633Z
UID:40343-1781175600-1781179200@hdpusergroup.org
SUMMARY:TCE Materials-CTE Validation
DESCRIPTION:CTE x-y and Z axis validation 
URL:https://hdpusergroup.org/event/tce-materials-cte-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T170000Z
DTEND:20260611T180000Z
DTSTAMP:20260605T152817
CREATED:20260515T130324Z
LAST-MODIFIED:20260515T130324Z
UID:40290-1781179200-1781182800@hdpusergroup.org
SUMMARY:Paste Interconnect Exploratory Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-exploratory-meeting-3/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T180000Z
DTEND:20260611T190000Z
DTSTAMP:20260605T152817
CREATED:20260515T133549Z
LAST-MODIFIED:20260515T133549Z
UID:40291-1781182800-1781186400@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limitations
DESCRIPTION:What are limitations related to plated through hole reliabilty? With designs approaching 30:1 and beyond\, what are the factors that contribute either to the success or failure of the the PTH? \nIs there a new or revised standard that is required to set expectations for rugged environments as well as those end products that must perform 24/7 365 days per year? \nthe kick-off meeting provided many ideas of key factos that could influence PTH plating sucess and reliability. \nIn addition\, the first order of business is to decide on a test vehicle and decide on a few key parameters to study initially. This project is considered a multi-phase exercise that will be set up as various parts. 
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limitations/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260611T190000Z
DTEND:20260611T200000Z
DTSTAMP:20260605T152817
CREATED:20260515T125154Z
LAST-MODIFIED:20260515T125154Z
UID:40289-1781186400-1781190000@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-Ups
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-21/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260615T150000Z
DTEND:20260615T160000Z
DTSTAMP:20260605T152817
CREATED:20260518T160059Z
LAST-MODIFIED:20260518T160059Z
UID:40333-1781517600-1781521200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-7/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260616T140000Z
DTEND:20260616T150000Z
DTSTAMP:20260605T152817
CREATED:20260528T150545Z
LAST-MODIFIED:20260528T150545Z
UID:40370-1781600400-1781604000@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-18/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260616T170000Z
DTEND:20260616T180000Z
DTSTAMP:20260605T152817
CREATED:20260521T181753Z
LAST-MODIFIED:20260521T181753Z
UID:40344-1781611200-1781614800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-3/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260617T020000Z
DTEND:20260617T030000Z
DTSTAMP:20260605T152817
CREATED:20260518T142226Z
LAST-MODIFIED:20260518T142226Z
UID:40331-1781643600-1781647200@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Kick-off Meeting
DESCRIPTION:Large Component PWB Warpage Project Kick-off Meeting 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-kick-off-meeting/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260617T140000Z
DTEND:20260617T150000Z
DTSTAMP:20260605T152817
CREATED:20260521T142526Z
LAST-MODIFIED:20260521T142526Z
UID:40340-1781686800-1781690400@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/better-caf-equation-16/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260617T150000Z
DTEND:20260617T160000Z
DTSTAMP:20260605T152817
CREATED:20260513T155344Z
LAST-MODIFIED:20260513T155344Z
UID:40226-1781690400-1781694000@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Ca
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-ca/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260617T200000Z
DTEND:20260617T210000Z
DTSTAMP:20260605T152817
CREATED:20260528T183951Z
LAST-MODIFIED:20260528T183951Z
UID:40378-1781708400-1781712000@hdpusergroup.org
SUMMARY:Copper Outer Layer Trace Adhesion
DESCRIPTION:Copper out trace adhesion method  
URL:https://hdpusergroup.org/event/copper-outer-layer-trace-adhesion/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260618T150000Z
DTEND:20260618T160000Z
DTSTAMP:20260605T152817
CREATED:20260514T153041Z
LAST-MODIFIED:20260514T153041Z
UID:40267-1781776800-1781780400@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-7/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260618T210000Z
DTEND:20260618T220000Z
DTSTAMP:20260605T152817
CREATED:20260521T223449Z
LAST-MODIFIED:20260521T223449Z
UID:40346-1781798400-1781802000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-37/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260624T150000Z
DTEND:20260624T160000Z
DTSTAMP:20260605T152817
CREATED:20260527T152038Z
LAST-MODIFIED:20260527T152038Z
UID:40360-1782295200-1782298800@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-47/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260625T150000Z
DTEND:20260625T160000Z
DTSTAMP:20260605T152817
CREATED:20260521T151745Z
LAST-MODIFIED:20260521T151745Z
UID:40342-1782381600-1782385200@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-9/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260625T160000Z
DTEND:20260625T170000Z
DTSTAMP:20260605T152817
CREATED:20260519T152316Z
LAST-MODIFIED:20260519T152316Z
UID:40106-1782385200-1782388800@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-6/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR