BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260908T130000Z
DTEND:20260908T140000Z
DTSTAMP:20260905T004146
CREATED:20260106T155543Z
LAST-MODIFIED:20260106T155543Z
UID:38751-1788854400-1788858000@hdpusergroup.org
SUMMARY:HDP Weekly Staff call
DESCRIPTION:Usual Staff Call 
URL:https://hdpusergroup.org/event/hdp-weekly-staff-call/2026-09-08/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260908T170000Z
DTEND:20260908T180000Z
DTSTAMP:20260905T004146
CREATED:20260831T141319Z
LAST-MODIFIED:20260831T141319Z
UID:41341-1788868800-1788872400@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-8/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260909T140000Z
DTEND:20260909T150000Z
DTSTAMP:20260905T004146
CREATED:20260825T141255Z
LAST-MODIFIED:20260825T141255Z
UID:41326-1788944400-1788948000@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-27/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260909T150000Z
DTEND:20260909T160000Z
DTSTAMP:20260905T004146
CREATED:20260813T152433Z
LAST-MODIFIED:20260813T152433Z
UID:41301-1788948000-1788951600@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-10/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260909T160000Z
DTEND:20260909T170000Z
DTSTAMP:20260905T004146
CREATED:20260812T165941Z
LAST-MODIFIED:20260812T165941Z
UID:41297-1788951600-1788955200@hdpusergroup.org
SUMMARY:TCE Materials-method validation
DESCRIPTION:continue discussion on the validation measurements and next steps. 
URL:https://hdpusergroup.org/event/tce-materials-method-validation-2/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260910T140000Z
DTEND:20260910T150000Z
DTSTAMP:20260905T004146
CREATED:20260702T145525Z
LAST-MODIFIED:20260702T145525Z
UID:40819-1789030800-1789034400@hdpusergroup.org
SUMMARY:Electrochemical Migration Phase 4
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/electrochemical-migration-phase-4/
CATEGORIES:Electro-Chemical Migration 4
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260910T150000Z
DTEND:20260910T160000Z
DTSTAMP:20260905T004146
CREATED:20260702T163812Z
LAST-MODIFIED:20260702T163812Z
UID:40826-1789034400-1789038000@hdpusergroup.org
SUMMARY:Better CAF Equation 2
DESCRIPTION:New Idea Project Kickoff 
URL:https://hdpusergroup.org/event/better-caf-equation-2-2/
CATEGORIES:Better CAF Acceleration Equation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260910T160000Z
DTEND:20260910T170000Z
DTSTAMP:20260905T004146
CREATED:20260831T120501Z
LAST-MODIFIED:20260831T120501Z
UID:41338-1789038000-1789041600@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-6/
CATEGORIES:Paste Interconnect
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260910T180000Z
DTEND:20260910T190000Z
DTSTAMP:20260905T004146
CREATED:20260831T121829Z
LAST-MODIFIED:20260831T121829Z
UID:41339-1789045200-1789048800@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/better-caf-equation-20/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260911T140000Z
DTEND:20260911T150000Z
DTSTAMP:20260905T004146
CREATED:20260827T151256Z
LAST-MODIFIED:20260827T151256Z
UID:41333-1789117200-1789120800@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-22/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260914T150000Z
DTEND:20260914T160000Z
DTSTAMP:20260905T004146
CREATED:20260831T212212Z
LAST-MODIFIED:20260831T212212Z
UID:41323-1789380000-1789383600@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Postponed by one week due to the Labor Day holiday. 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-11/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260915T010000Z
DTEND:20260915T020000Z
DTSTAMP:20260905T004146
CREATED:20260901T015954Z
LAST-MODIFIED:20260901T015954Z
UID:41345-1789416000-1789419600@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-6/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260915T130000Z
DTEND:20260915T140000Z
DTSTAMP:20260905T004146
CREATED:20260106T155543Z
LAST-MODIFIED:20260106T155543Z
UID:38773-1789459200-1789462800@hdpusergroup.org
SUMMARY:HDP Weekly Staff call
DESCRIPTION:Usual Staff Call 
URL:https://hdpusergroup.org/event/hdp-weekly-staff-call/2026-09-15/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260915T150000Z
DTEND:20260915T160000Z
DTSTAMP:20260905T004146
CREATED:20260902T133916Z
LAST-MODIFIED:20260902T133916Z
UID:41347-1789466400-1789470000@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-21/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260916T150000Z
DTEND:20260916T160000Z
DTSTAMP:20260905T004146
CREATED:20260819T152707Z
LAST-MODIFIED:20260819T152707Z
UID:41320-1789552800-1789556400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-51/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260917T150000Z
DTEND:20260917T160000Z
DTSTAMP:20260905T004146
CREATED:20260903T162830Z
LAST-MODIFIED:20260903T162830Z
UID:41356-1789639200-1789642800@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-10/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260917T210000Z
DTEND:20260917T220000Z
DTSTAMP:20260905T004146
CREATED:20260827T220824Z
LAST-MODIFIED:20260827T220824Z
UID:41334-1789660800-1789664400@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-42/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260922T130000Z
DTEND:20260922T140000Z
DTSTAMP:20260905T004146
CREATED:20260106T155543Z
LAST-MODIFIED:20260106T155543Z
UID:38903-1790064000-1790067600@hdpusergroup.org
SUMMARY:HDP Weekly Staff call
DESCRIPTION:Usual Staff Call 
URL:https://hdpusergroup.org/event/hdp-weekly-staff-call/2026-09-22/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260922T180000Z
DTEND:20260922T190000Z
DTSTAMP:20260905T004146
CREATED:20260831T120310Z
LAST-MODIFIED:20260831T120310Z
UID:41337-1790082000-1790085600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build-Ups
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-ups-23/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260923T140000Z
DTEND:20260923T150000Z
DTSTAMP:20260905T004146
CREATED:20260902T150714Z
LAST-MODIFIED:20260902T150714Z
UID:41351-1790154000-1790157600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project WebEx Call
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-webex-call-3/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260923T150000Z
DTEND:20260923T160000Z
DTSTAMP:20260905T004146
CREATED:20260826T183140Z
LAST-MODIFIED:20260826T183140Z
UID:41329-1790157600-1790161200@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-18/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260923T160000Z
DTEND:20260923T170000Z
DTSTAMP:20260905T004146
CREATED:20260903T120601Z
LAST-MODIFIED:20260903T120601Z
UID:41353-1790161200-1790164800@hdpusergroup.org
SUMMARY:High Aspect Ratio Plating Limits
DESCRIPTION:continue discussion on test vehicles as a tool  
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating-limits-4/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260925T000000Z
DTEND:20260925T010000Z
DTSTAMP:20260905T004146
CREATED:20260828T013328Z
LAST-MODIFIED:20260828T013328Z
UID:41335-1790276400-1790280000@hdpusergroup.org
SUMMARY:Porosity Testing 2
DESCRIPTION:Phase 1 of the project  studied select  methods for determining gold porosity for surface finishes. Current methods use (MFG\, FoS\, nitric acid and sodium hydrogen sulfide). \nFour solderable finishes were selected and subjected to porosity testing. \nResults showed nitric acid testing along with a novel xray approach was very successful in finding and quantifying degrees of porosity for each of the finishes selected. \nExpand the porosity testing method (nitric acid) from Phase 1 to a new set of down selected solderable finishes \nValidate porosity test method from Phase 1 to selected  solderable finishes being evaluated in Phase 2 \nAs in phase 1\, the benefits of this study will provide a quantitative and repeatable test method to measure porosity for different solderable finishes \nA second benefit will provide designers and OEMs with critical solderable finish plating thicknesses data that are critical in minimizing porosity under corrosive conditions 
URL:https://hdpusergroup.org/event/porosity-testing-2-5/
CATEGORIES:Porosity Testing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260929T130000Z
DTEND:20260929T140000Z
DTSTAMP:20260905T004146
CREATED:20260106T155543Z
LAST-MODIFIED:20260106T155543Z
UID:38990-1790668800-1790672400@hdpusergroup.org
SUMMARY:HDP Weekly Staff call
DESCRIPTION:Usual Staff Call 
URL:https://hdpusergroup.org/event/hdp-weekly-staff-call/2026-09-29/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR