June 29 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 June 29 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 Final Finish Layer Deposits for High Frequency, Phase 2 and 3
June 30 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement June 30 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement Meeting
June 30 @ 12:00 pm - 1:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call June 30 @ 12:00 pm - 1:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call Periodic Project Call
June 30 @ 9:00 pm - 10:00 pm CDT Large Component PWB Warpage Project Call June 30 @ 9:00 pm - 10:00 pm CDT Large Component PWB Warpage Project Call Large Component PWB Warpage Project Call
July 1 @ 11:30 pm - 11:45 pm CDT curt testing July 1 @ 11:30 pm - 11:45 pm CDT curt testing testing meeting notices to curt mitchell
July 2 @ 9:00 am - 10:00 am CDT Electrochemical Migration 4 July 2 @ 9:00 am - 10:00 am CDT Electrochemical Migration 4 Project Meeting
July 2 @ 10:00 am - 11:00 am CDT Better CAF Equation July 2 @ 10:00 am - 11:00 am CDT Better CAF Equation Meeting
July 2 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis July 2 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis The project has entered the implementation phase, with participation limited to members and non-members approved for continued involvement.
July 6 @ 10:00 pm - 11:00 pm CDT Foxconn – HDP Discussion July 6 @ 10:00 pm - 11:00 pm CDT Foxconn – HDP Discussion Foxconn – HDP Discussion
July 7 @ 12:00 pm - 1:00 pm CDT Harsh Use Alloy Evaluations Project Call July 7 @ 12:00 pm - 1:00 pm CDT Harsh Use Alloy Evaluations Project Call Periodic Project Call
July 8 @ 9:00 am - 10:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call July 8 @ 9:00 am - 10:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call Investigate New Test Methods for Copper Foil Adhesion Project Call
July 8 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Ca July 8 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Ca Meeting
July 8 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call July 8 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call Correlating CF Profile to Signal Integrity Project Call
July 9 @ 10:00 am - 11:00 am CDT Paste Interconnect July 9 @ 10:00 am - 11:00 am CDT Paste Interconnect Meeting
July 9 @ 10:00 am - 11:00 am CDT Paste Interconnect July 9 @ 10:00 am - 11:00 am CDT Paste Interconnect Meeting
July 9 @ 3:00 pm - 4:00 pm CDT Copper Outer Layer Trace Adhesion July 9 @ 3:00 pm - 4:00 pm CDT Copper Outer Layer Trace Adhesion Thin Ttrace adhesion project.
July 14 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement July 14 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement Meeting
July 14 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting July 14 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting Meeting
July 14 @ 8:00 pm - 9:00 pm CDT Large Component PWB Warpage Project Call July 14 @ 8:00 pm - 9:00 pm CDT Large Component PWB Warpage Project Call Large Component PWB Warpage Project Call
July 15 @ 9:00 am - 10:00 am CDT D-Coupon IST CITC Reliability Testing July 15 @ 9:00 am - 10:00 am CDT D-Coupon IST CITC Reliability Testing Project Team Meeting
July 15 @ 10:00 am - 11:00 am CDT Inner Layer Copper Balancing 2 July 15 @ 10:00 am - 11:00 am CDT Inner Layer Copper Balancing 2 Project Meeting
July 15 @ 11:00 am - 12:00 pm CDT TCE Materials July 15 @ 11:00 am - 12:00 pm CDT TCE Materials Calibration and validation of CTE test method update
July 16 @ 9:00 am - 10:00 am CDT Thin Dielectric Skew Project July 16 @ 9:00 am - 10:00 am CDT Thin Dielectric Skew Project Project Meeting
July 16 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach July 16 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach Meeting
July 16 @ 11:00 am - 12:00 pm CDT Non-Glass Microvia July 16 @ 11:00 am - 12:00 pm CDT Non-Glass Microvia Meeting
July 17 @ 9:00 am - 10:00 am CDT Better CAF Equation July 17 @ 9:00 am - 10:00 am CDT Better CAF Equation Meeting
July 21 @ 12:00 pm - 1:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call July 21 @ 12:00 pm - 1:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call Periodic Project Call
July 22 @ 9:00 am - 10:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call July 22 @ 9:00 am - 10:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call Investigate New Test Methods for Copper Foil Adhesion Project Call
July 22 @ 10:00 am - 11:00 am CDT SIR Testing meeting July 22 @ 10:00 am - 11:00 am CDT SIR Testing meeting Meeting
July 23 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Call July 23 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Call Meeting
July 23 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis July 23 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis Glass Substrate Reliability Analysis
July 27 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 July 27 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 Final Finish Layer Deposits for High Frequency, Phase 2 and 3
July 29 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call July 29 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call Correlating CF Profile to Signal Integrity Project Call
June 30 @ 12:00 pm - 1:00 pm Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
July 21 @ 12:00 pm - 1:00 pm Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call