March 31 @ 10:00 am - 11:00 am CDT SIR Testing meeting March 31 @ 10:00 am - 11:00 am CDT SIR Testing meeting Meeting
March 31 @ 2:00 pm - 3:00 pm CDT Project Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability March 31 @ 2:00 pm - 3:00 pm CDT Project Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability
April 1 @ 10:00 am - 11:00 am CDT Inner Layer Copper Balancing 2 April 1 @ 10:00 am - 11:00 am CDT Inner Layer Copper Balancing 2 Project Meeting
April 1 @ 3:00 pm - 4:00 pm CDT Cu Outer Trace Adhesion April 1 @ 3:00 pm - 4:00 pm CDT Cu Outer Trace Adhesion Work on final report
April 1 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call April 1 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call Correlating CF Profile to Signal Integrity Project Call
April 2 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach April 2 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach Meeting
April 2 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis April 2 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis *Due to an urgent matter involving the leader (Rich DePoto), the schedule has been changed to March 26–April 2.
April 2 @ 7:00 pm - 8:00 pm CDT Porosity April 2 @ 7:00 pm - 8:00 pm CDT Porosity Any last minute changes to BoD application for Phase 2 Next final report draft
April 7 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement April 7 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement Meeting
April 7 @ 12:00 pm - 1:00 pm CDT HDP Harsh Use Alloy Evaluation Project Call April 7 @ 12:00 pm - 1:00 pm CDT HDP Harsh Use Alloy Evaluation Project Call Periodic Project Call
April 8 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Call April 8 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Call Meeting
April 8 @ 11:00 am - 12:00 pm CDT Thin Dielectric Skew Project April 8 @ 11:00 am - 12:00 pm CDT Thin Dielectric Skew Project Project WebEx Call
April 13 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 April 13 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 Final Finish Layer Deposits for High Frequency, Phase 2 and 3
April 14 @ 10:00 am - 11:00 am CDT Better CAF Eq April 14 @ 10:00 am - 11:00 am CDT Better CAF Eq Work on final report
April 14 @ 2:00 pm - 3:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call April 14 @ 2:00 pm - 3:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call Periodic Project Call
April 15 @ 3:00 pm - 4:00 pm CDT Cu Outer Trace Adhesion April 15 @ 3:00 pm - 4:00 pm CDT Cu Outer Trace Adhesion Work on final report
April 16 @ 9:00 am - 10:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call April 16 @ 9:00 am - 10:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call Investigate New Test Methods for Copper Foil Adhesion Project Call
April 16 @ 10:00 am - 11:00 am CDT D-Coupon IST CITC Reliability Testing April 16 @ 10:00 am - 11:00 am CDT D-Coupon IST CITC Reliability Testing Project WebEx Meeting
April 16 @ 2:00 pm - 3:00 pm CDT Non-Glass Microvia Build-ups April 16 @ 2:00 pm - 3:00 pm CDT Non-Glass Microvia Build-ups Latest FA results Work on final report?
April 22 @ 10:00 am - 11:00 am CDT SIR Testing meeting April 22 @ 10:00 am - 11:00 am CDT SIR Testing meeting Meeting
April 23 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach April 23 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach Meeting
April 23 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis April 23 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis Glass Substrate Reliability Analysis
April 30 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting April 30 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting Meeting
March 31 @ 2:00 pm - 3:00 pm Project Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability
April 14 @ 2:00 pm - 3:00 pm Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call