Name: Paste Interconnect Exploratory Meeting
Start: 2026-05-14T12:00:00-05:00
End: 2026-05-14T13:00:00-05:00

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Paste Interconnect Exploratory Meeting

May 14 @ 12:00 pm - 1:00 pm CDT

« Thermal cooling methods-New Idea Discussion
High aspect ratio through hole plating limits »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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