Name: Paste Interconnect Exploratory Meeting
Start: 2026-04-28T12:00:00-05:00
End: 2026-04-28T13:00:00-05:00

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Paste Interconnect Exploratory Meeting

April 28 @ 12:00 pm - 1:00 pm CDT

« Stacked Microvia Capability Improvement
Effect of Metal Additions on Solder Joint Reliability Project Call »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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