Discussion new idea project for Thermal Cooling Methods. New Project Idea Call “Cooling Methods for Heat Dissipation” There are significant challenges introduced by advanced packaging in terms of power delivery and thermal management. New thermal solutions (not including li...

Meeting

New Project Idea Call   High Aspect Ratio Through Hole Limits With AI, High Performance Computing, Data Centers, ADAS among other technologies, layer counts are increasing. In addition, aspect ratios of the plated through holes are becoming more challenging. It has long been recogn...