- Have any questions?
- info@hdpug.org
35 events found.
Calendar of Events
S Sun
M Mon
T Tue
W Wed
T Thu
F Fri
S Sat
0 events,
1 event,
3 events,
2 events,
4 events,
D-Coupon IST CITC Reliability Testing Project
D-Coupon IST CITC Reliability Testing Project
Evaluate how typical D-Coupon, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used.
0 events,
0 events,
0 events,
2 events,
4 events,
Non-Glass Microvia Build-ups
Non-Glass Microvia Build-ups
Update from Sabmina
Go over first draft of presentation for Members' Meetting
0 events,
0 events,
0 events,
2 events,
3 events,
Inner Layer Copper Balancing 2
Inner Layer Copper Balancing 2
This project seeks to develop a CAD translator utility for members that will provide analysis of local copper distribution to identify risk areas for: Core deformation and backdrill stub variation; Surface T...
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
3 events,
TCE Materials-CTE Method validation
TCE Materials-CTE Method validation
There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critic...
0 events,
0 events,
0 events,
0 events,
3 events,
3 events,
Thin Dielectric Skew Project Kickoff
Thin Dielectric Skew Project Kickoff
Evaluate the worst case electrical skew when using thinner dielectrics, particularly L-glass. Results may indicate how electrical skew can be mitigated using some design, process, material, and/or other opti...
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
1 event,
0 events,
0 events,
0 events,
2 events,
D-Coupon IST CITC Reliability Testing Project
D-Coupon IST CITC Reliability Testing Project
Evaluate how typical D-Coupon, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used.
Final Finish Layer Deposits for High Frequency
Final Finish Layer Deposits for High Frequency
Final Report review and discussion planned — all interested are welcome