Name: Pb Free Materials 7 Project Ca
Start: 2026-07-08T10:00:00-05:00
End: 2026-07-08T11:00:00-05:00

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7 events found.

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No events scheduled for July 5, 2026.

10:00 pm

July 6 @ 10:00 pm - 11:00 pm

Harsh Use Alloy Evaluations Project Call

9:00 am

July 8 @ 9:00 am - 10:00 am

Investigate New Test Methods for Copper Foil Adhesion Project Call

10:00 am

July 8 @ 10:00 am - 11:00 am

Pb Free Materials 7 Project Ca

8:00 pm

July 8 @ 8:00 pm - 9:00 pm

Correlating CF Profile to Signal Integrity Project Call

10:00 am

July 9 @ 10:00 am - 11:00 am

Copper Outer Layer Trace Adhesion

No events scheduled for July 10, 2026.

No events scheduled for July 11, 2026.

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10:00 pm - 11:00 pm

Foxconn – HDP Discussion

July 6 @ 10:00 pm - 11:00 pm

Harsh Use Alloy Evaluations Project Call

July 7 @ 12:00 pm - 1:00 pm

Harsh Use Alloy Evaluations Project Call

Periodic Project Call

9:00 am - 10:00 am

Investigate New Test Methods for Copper Foil Adhesion Project Call

July 8 @ 9:00 am - 10:00 am

Investigate New Test Methods for Copper Foil Adhesion Project Call

10:00 am - 11:00 am

Pb Free Materials 7 Project Ca

July 8 @ 10:00 am - 11:00 am

Pb Free Materials 7 Project Ca

Meeting

8:00 pm - 9:00 pm

Correlating CF Profile to Signal Integrity Project Call

July 8 @ 8:00 pm - 9:00 pm

Correlating CF Profile to Signal Integrity Project Call

10:00 am - 11:00 am

Paste Interconnect

July 9 @ 10:00 am - 11:00 am

Paste Interconnect

July 9 @ 10:00 am - 11:00 am

Copper Outer Layer Trace Adhesion

July 9 @ 3:00 pm - 4:00 pm

Copper Outer Layer Trace Adhesion

Thin Ttrace adhesion project.

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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