Name: Glass Substrate Reliability Analysis
Start: 2025-10-23T16:00:00-05:00
End: 2025-10-23T17:00:00-05:00

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10:00 am

October 21, 2025 @ 10:00 am - 11:00 am

ECM-4

11:00 am

October 21, 2025 @ 11:00 am - 12:00 pm

Stacked Microvia Capability Improvement

9:00 am

October 22, 2025 @ 9:00 am - 10:00 am

Thin Dielectric Skew Project Kickoff

10:00 am

October 22, 2025 @ 10:00 am - 11:00 am

PCB Flatness at Large Package Attach Locations

7:00 pm

October 22, 2025 @ 7:00 pm - 8:00 pm

Investigate New Test Methods for Copper Foil Adhesion Project Call

4:00 pm

October 23, 2025 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

9:00 am

October 24, 2025 @ 9:00 am - 10:00 am

Holy Trinity of Problems Charts

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10:00 am - 11:00 am

ECM-4

October 21, 2025 @ 10:00 am - 11:00 am

Stacked Microvia Capability Improvement

October 21, 2025 @ 11:00 am - 12:00 pm

Stacked Microvia Capability Improvement

Meeting

9:00 am - 10:00 am

Thin Dielectric Skew Project Kickoff

October 22, 2025 @ 9:00 am - 10:00 am

Thin Dielectric Skew Project Kickoff

Evaluate the worst case electrical skew when using thinner dielectrics, particularly L-glass. Results may indicate how electrical skew can be mitigated using some design, process, material, and/or other opti...

10:00 am - 11:00 am

PCB Flatness at Large Package Attach Locations

October 22, 2025 @ 10:00 am - 11:00 am

PCB Flatness at Large Package Attach Locations

Meeting

7:00 pm - 8:00 pm

Investigate New Test Methods for Copper Foil Adhesion Project Call

October 22, 2025 @ 7:00 pm - 8:00 pm

Investigate New Test Methods for Copper Foil Adhesion Project Call

4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

October 23, 2025 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

9:00 am - 10:00 am

Holy Trinity of Problems Charts

October 24, 2025 @ 9:00 am - 10:00 am

Holy Trinity of Problems Charts

Discuss Charts for problem discussion

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