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7 events found.
Week of Events
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training
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Reflow Cycle Via Reliability Impact Project Call
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SIR Testing meeting
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Cu Trace Adhesion Call
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Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
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Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
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Materials #7 meeting
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D Coupon/IST/CITC Reliability Testing
D Coupon/IST/CITC Reliability Testing
Printed circuit board through-hole via and microvia reliability are continuing concerns in the electronics industry. The industry is using smaller and higher aspect ratio vias and microvias, and the selectio...
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TCE materials-validating test methods for X-Y CTE
TCE materials-validating test methods for X-Y CTE
There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critic...
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