D Coupon/IST/CITC Reliability Testing

Printed circuit board through-hole via and microvia reliability are continuing concerns in the electronics industry. The industry is using smaller and higher aspect ratio vias and microvias, and the selection of the optimum assembly reflow cycle is more critical. Although D-Coupon, IST ...

TCE materials-validating test methods for X-Y CTE

There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critical and will positively affect solder joint reliability. A relative comparison of...