Name: Non-contact CF Profile Project Call
Start: 2023-01-09T19:00:00-06:00
End: 2023-01-09T20:00:00-06:00

No events scheduled for January 8, 2023.

9:00 am

January 9, 2023 @ 9:00 am - 10:00 am

SIR Testing

10:00 am

January 9, 2023 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency

11:00 am

January 9, 2023 @ 11:00 am - 12:00 pm

Reduced cost CAF

7:00 pm

January 9, 2023 @ 7:00 pm - 8:00 pm

Non-contact CF Profile Project Call

8:00 am

January 12, 2023 @ 8:00 am - 9:00 am

Better CAF Eq

10:00 am

January 12, 2023 @ 10:00 am - 11:00 am

Materials #7 meeting

11:00 am

January 12, 2023 @ 11:00 am - 12:00 pm

innerlayer copper balancing

12:00 pm

January 12, 2023 @ 12:00 pm - 1:00 pm

PCB Feature Min

2:00 pm

January 12, 2023 @ 2:00 pm - 3:00 pm

Microvia Rel

January 12, 2023 @ 2:00 pm - 3:00 pm

Microvia Rel

3:00 pm

January 12, 2023 @ 3:00 pm - 4:00 pm

Cu Surface Treatment vs Loss Project Call

Export Events

SIR Testing

Final Finish Layer Deposits for High Frequency

Reduced cost CAF

Non-contact CF Profile Project Call

Harsh Use Alloy Evaluations Project Call

High Speed Hybrid PWB Project Call

TA Methods

Photo Soldering 2

Better CAF Eq

Materials #7 meeting

innerlayer copper balancing

PCB Feature Min

Microvia Rel

Microvia Rel

Cu Surface Treatment vs Loss Project Call

Effects of Plating Thickness on CFT at IST Project Call

SIR Testing

Final Finish Layer Deposits for High Frequency

Reduced cost CAF

Non-contact CF Profile Project Call

Harsh Use Alloy Evaluations Project Call

High Speed Hybrid PWB Project Call

TA Methods

Photo Soldering 2

Better CAF Eq

Materials #7 meeting

innerlayer copper balancing

PCB Feature Min

Microvia Rel

Microvia Rel

Cu Surface Treatment vs Loss Project Call

Effects of Plating Thickness on CFT at IST Project Call

Week of Events

Sun 8

Mon 9

Tue 10

Wed 11

Thu 12

Fri 13

Sat 14

SIR Testing

Final Finish Layer Deposits for High Frequency

Reduced cost CAF

Non-contact CF Profile Project Call

Harsh Use Alloy Evaluations Project Call

High Speed Hybrid PWB Project Call

TA Methods

Photo Soldering 2

Better CAF Eq

Materials #7 meeting

innerlayer copper balancing

PCB Feature Min

Microvia Rel

Microvia Rel

Cu Surface Treatment vs Loss Project Call

Effects of Plating Thickness on CFT at IST Project Call