June 10 @ 10:00 am - 11:00 am CDT Inner Layer Copper Balancing 2 June 10 @ 10:00 am - 11:00 am CDT Inner Layer Copper Balancing 2 Project Meeting Minutes
June 10 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call June 10 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call Correlating CF Profile to Signal Integrity Project Call
June 11 @ 10:00 am - 11:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call June 11 @ 10:00 am - 11:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call Investigate New Test Methods for Copper Foil Adhesion Project Call
June 11 @ 11:00 am - 12:00 pm CDT TCE Materials-CTE Validation June 11 @ 11:00 am - 12:00 pm CDT TCE Materials-CTE Validation CTE x-y and Z axis validation
June 15 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 June 15 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 Final Finish Layer Deposits for High Frequency, Phase 2 and 3
June 16 @ 9:00 am - 10:00 am CDT D-Coupon IST CITC Reliability Testing June 16 @ 9:00 am - 10:00 am CDT D-Coupon IST CITC Reliability Testing Project Meeting
June 16 @ 12:00 pm - 1:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call June 16 @ 12:00 pm - 1:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call Periodic Project Call
June 16 @ 9:00 pm - 10:00 pm CDT Large Component PWB Warpage Project Kick-off Meeting June 16 @ 9:00 pm - 10:00 pm CDT Large Component PWB Warpage Project Kick-off Meeting Large Component PWB Warpage Project Kick-off Meeting
June 17 @ 9:00 am - 10:00 am CDT Better CAF Equation June 17 @ 9:00 am - 10:00 am CDT Better CAF Equation Meeting
June 17 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Ca June 17 @ 10:00 am - 11:00 am CDT Pb Free Materials 7 Project Ca Meeting
June 17 @ 3:00 pm - 4:00 pm CDT Copper Outer Layer Trace Adhesion June 17 @ 3:00 pm - 4:00 pm CDT Copper Outer Layer Trace Adhesion Copper out trace adhesion method
June 18 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach June 18 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach Meeting
June 18 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis June 18 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis Glass Substrate Reliability Analysis
June 24 @ 10:00 am - 11:00 am CDT SIR Testing meeting June 24 @ 10:00 am - 11:00 am CDT SIR Testing meeting Meeting
June 25 @ 10:00 am - 11:00 am CDT Thin Dielectric Skew Project June 25 @ 10:00 am - 11:00 am CDT Thin Dielectric Skew Project Project Meeting
June 25 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting June 25 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting Meeting
June 16 @ 12:00 pm - 1:00 pm Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call