July 27 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 July 27 @ 10:00 am - 11:00 am CDT Final Finish Layer Deposits for High Frequency, Phase 2 and 3 Final Finish Layer Deposits for High Frequency, Phase 2 and 3
July 29 @ 9:00 am - 10:00 am CDT D-Coupon IST CITC Reliability Testing July 29 @ 9:00 am - 10:00 am CDT D-Coupon IST CITC Reliability Testing Project Team Meeting
July 29 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call July 29 @ 8:00 pm - 9:00 pm CDT Correlating CF Profile to Signal Integrity Project Call Correlating CF Profile to Signal Integrity Project Call
July 30 @ 11:00 am - 12:00 pm CDT Non-Glass Microvia Build-Ups July 30 @ 11:00 am - 12:00 pm CDT Non-Glass Microvia Build-Ups Meeting
August 3 @ 8:00 pm - 9:00 pm CDT Large Component PWB Warpage Project Call August 3 @ 8:00 pm - 9:00 pm CDT Large Component PWB Warpage Project Call Large Component PWB Warpage Project Call
August 4 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement August 4 @ 10:00 am - 11:00 am CDT Stacked Microvia Capability Improvement Meeting
August 4 @ 12:00 pm - 1:00 pm CDT Harsh Use Alloy Evaluations Project Call August 4 @ 12:00 pm - 1:00 pm CDT Harsh Use Alloy Evaluations Project Call Periodic Project Call
August 5 @ 8:00 am - 9:00 am CDT SIR Testing meeting August 5 @ 8:00 am - 9:00 am CDT SIR Testing meeting Meeting
August 5 @ 9:00 am - 10:00 am CDT Thin Dielectric Skew Project August 5 @ 9:00 am - 10:00 am CDT Thin Dielectric Skew Project Project Team Meeting
August 5 @ 10:00 am - 11:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call August 5 @ 10:00 am - 11:00 am CDT Investigate New Test Methods for Copper Foil Adhesion Project Call Investigate New Test Methods for Copper Foil Adhesion Project Call
August 6 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting August 6 @ 11:00 am - 12:00 pm CDT Sequential Lamination Meeting Meeting
August 6 @ 1:00 pm - 2:00 pm CDT Pb Free Materials 7 Project Call August 6 @ 1:00 pm - 2:00 pm CDT Pb Free Materials 7 Project Call Meeting
August 6 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis August 6 @ 4:00 pm - 5:00 pm CDT Glass Substrate Reliability Analysis Glass Substrate Reliability Analysis
August 11 @ 12:00 pm - 1:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call August 11 @ 12:00 pm - 1:00 pm CDT Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call Periodic Project Call
August 12 @ 11:00 am - 12:00 pm CDT TCE Materials-CTE measurement validation August 12 @ 11:00 am - 12:00 pm CDT TCE Materials-CTE measurement validation Validation of improved TM for CTE measurements. ensure consistency across the supply chain.
August 12 @ 1:00 pm - 2:00 pm CDT high aspect ratio plating August 12 @ 1:00 pm - 2:00 pm CDT high aspect ratio plating TV discussion.
August 13 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach August 13 @ 10:00 am - 11:00 am CDT PCB Flatness at Lg Package Attach Meeting
August 13 @ 11:00 am - 12:00 pm CDT Paste Interconnect August 13 @ 11:00 am - 12:00 pm CDT Paste Interconnect Meeting
August 11 @ 12:00 pm - 1:00 pm Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call