Name: high aspect ratio plating
Start: 2026-08-12T13:00:00-05:00
End: 2026-08-12T14:00:00-05:00

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high aspect ratio plating

August 12 @ 1:00 pm - 2:00 pm CDT

« TCE Materials-CTE measurement validation
PCB Flatness at Lg Package Attach »

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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