BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20260308T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20261101T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20260804T010000Z
DTEND:20260804T020000Z
DTSTAMP:20260921T044345
CREATED:20260716T065335Z
LAST-MODIFIED:20260716T065335Z
UID:40943-1785787200-1785790800@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-3/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260804T150000Z
DTEND:20260804T160000Z
DTSTAMP:20260921T044345
CREATED:20260722T140430Z
LAST-MODIFIED:20260722T140430Z
UID:41146-1785837600-1785841200@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-18/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260804T170000Z
DTEND:20260804T180000Z
DTSTAMP:20260921T044345
CREATED:20260724T174302Z
LAST-MODIFIED:20260724T174302Z
UID:41165-1785844800-1785848400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call-13/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260805T130000Z
DTEND:20260805T140000Z
DTSTAMP:20260921T044345
CREATED:20260722T153008Z
LAST-MODIFIED:20260722T153008Z
UID:41151-1785916800-1785920400@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-49/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260805T140000Z
DTEND:20260805T150000Z
DTSTAMP:20260921T044345
CREATED:20260716T143920Z
LAST-MODIFIED:20260716T143920Z
UID:40984-1785920400-1785924000@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-11/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260805T150000Z
DTEND:20260805T160000Z
DTSTAMP:20260921T044345
CREATED:20260722T151527Z
LAST-MODIFIED:20260722T151527Z
UID:41148-1785924000-1785927600@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-25/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T140000Z
DTEND:20260806T150000Z
DTSTAMP:20260921T044345
CREATED:20260728T184406Z
LAST-MODIFIED:20260728T184406Z
UID:40950-1786006800-1786010400@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-20/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T160000Z
DTEND:20260806T170000Z
DTSTAMP:20260921T044345
CREATED:20260714T170302Z
LAST-MODIFIED:20260714T170302Z
UID:40890-1786014000-1786017600@hdpusergroup.org
SUMMARY:Sequential Lamination Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-meeting-8/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T180000Z
DTEND:20260806T190000Z
DTSTAMP:20260921T044345
CREATED:20260723T153733Z
LAST-MODIFIED:20260723T153733Z
UID:41156-1786021200-1786024800@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-16/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260806T210000Z
DTEND:20260806T220000Z
DTSTAMP:20260921T044345
CREATED:20260724T070752Z
LAST-MODIFIED:20260724T070752Z
UID:41164-1786032000-1786035600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-40/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260807T010000Z
DTEND:20260807T020000Z
DTSTAMP:20260921T044345
CREATED:20260717T013458Z
LAST-MODIFIED:20260717T013458Z
UID:41000-1786046400-1786050000@hdpusergroup.org
SUMMARY:Porosity Testing 2
DESCRIPTION:Expand on method developed in Phase 1 with nickel free finishes for phase 2. 
URL:https://hdpusergroup.org/event/porosity-testing-2-3/
CATEGORIES:Porosity Testing 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260811T160000Z
DTEND:20260811T170000Z
DTSTAMP:20260921T044345
CREATED:20260804T164016Z
LAST-MODIFIED:20260804T164016Z
UID:41241-1786446000-1786449600@hdpusergroup.org
SUMMARY:Call with Cisco
DESCRIPTION:Call with Vy at Cisco 
URL:https://hdpusergroup.org/event/call-with-cisco/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260811T170000Z
DTEND:20260811T180000Z
DTSTAMP:20260921T044345
CREATED:20260724T174743Z
LAST-MODIFIED:20260724T174743Z
UID:41166-1786449600-1786453200@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-6/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260812T160000Z
DTEND:20260812T170000Z
DTSTAMP:20260921T044345
CREATED:20260715T163720Z
LAST-MODIFIED:20260715T163720Z
UID:40951-1786532400-1786536000@hdpusergroup.org
SUMMARY:TCE Materials-CTE measurement validation
DESCRIPTION:Validation of improved TM for CTE measurements. ensure consistency across the supply chain.  
URL:https://hdpusergroup.org/event/tce-materials-cte-measurement-validation/
CATEGORIES:TCE Materials Dimensional Properties
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260812T180000Z
DTEND:20260812T190000Z
DTSTAMP:20260921T044345
CREATED:20260715T190135Z
LAST-MODIFIED:20260715T190135Z
UID:40953-1786539600-1786543200@hdpusergroup.org
SUMMARY:high aspect ratio plating
DESCRIPTION:TV discussion.  
URL:https://hdpusergroup.org/event/high-aspect-ratio-plating/
CATEGORIES:High Aspect Ratio Plating
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260813T150000Z
DTEND:20260813T160000Z
DTSTAMP:20260921T044345
CREATED:20260716T152418Z
LAST-MODIFIED:20260716T152418Z
UID:40986-1786615200-1786618800@hdpusergroup.org
SUMMARY:PCB Flatness at Lg Package Attach
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pcb-flatness-at-lg-package-attach-9/
CATEGORIES:PCB Flatness for LG Mod Attach
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260813T160000Z
DTEND:20260813T170000Z
DTSTAMP:20260921T044345
CREATED:20260723T181252Z
LAST-MODIFIED:20260723T181252Z
UID:41157-1786618800-1786622400@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-4/
CATEGORIES:Paste Interconnect
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260813T180000Z
DTEND:20260813T190000Z
DTSTAMP:20260921T044345
CREATED:20260810T125647Z
LAST-MODIFIED:20260810T125647Z
UID:41276-1786626000-1786629600@hdpusergroup.org
SUMMARY:Non-Glass Microvia Build Up
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvia-build-up/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260818T010000Z
DTEND:20260818T020000Z
DTSTAMP:20260921T044345
CREATED:20260804T020112Z
LAST-MODIFIED:20260804T020112Z
UID:41237-1786996800-1787000400@hdpusergroup.org
SUMMARY:Large Component PWB Warpage Project Call
DESCRIPTION:Large Component PWB Warpage Project Call 
URL:https://hdpusergroup.org/event/large-component-pwb-warpage-project-call-4/
CATEGORIES:Large Component PWB Warpage
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260818T150000Z
DTEND:20260818T160000Z
DTSTAMP:20260921T044345
CREATED:20260810T130050Z
LAST-MODIFIED:20260810T130050Z
UID:41278-1787047200-1787050800@hdpusergroup.org
SUMMARY:Stacked Microvia Capability Improvement
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/stacked-microvia-capability-improvement-19/
CATEGORIES:Stacked vs. Staggered Microvias
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260819T140000Z
DTEND:20260819T150000Z
DTSTAMP:20260921T044345
CREATED:20260805T145508Z
LAST-MODIFIED:20260805T145508Z
UID:41246-1787130000-1787133600@hdpusergroup.org
SUMMARY:Thin Dielectric Skew Project WebEx Call
DESCRIPTION:Project Team Meeting 
URL:https://hdpusergroup.org/event/thin-dielectric-skew-project-webex-call/
CATEGORIES:Thin Dielectric Skew
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260819T150000Z
DTEND:20260819T160000Z
DTSTAMP:20260921T044345
CREATED:20260805T132620Z
LAST-MODIFIED:20260805T132620Z
UID:41243-1787133600-1787137200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-50/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260821T140000Z
DTEND:20260821T150000Z
DTSTAMP:20260921T044345
CREATED:20260727T135229Z
LAST-MODIFIED:20260727T135229Z
UID:41168-1787302800-1787306400@hdpusergroup.org
SUMMARY:Better CAF Equation
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/better-caf-equation-19/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260824T150000Z
DTEND:20260824T160000Z
DTSTAMP:20260921T044345
CREATED:20260814T113530Z
LAST-MODIFIED:20260814T113530Z
UID:41170-1787565600-1787569200@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency\, Phase 2 and 3
DESCRIPTION:Due to an urgent leader matter\, we are pushing this back by one week. Apologies for the last-minute change. 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-phase-2-and-3-10/
CATEGORIES:Final Finish Layer Deposits for High Frequency Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260825T140000Z
DTEND:20260825T150000Z
DTSTAMP:20260921T044345
CREATED:20260818T065403Z
LAST-MODIFIED:20260818T065403Z
UID:41247-1787648400-1787652000@hdpusergroup.org
SUMMARY:Investigate New Test Methods for Copper Foil Adhesion Project Call
DESCRIPTION:Investigate New Test Methods for Copper Foil Adhesion Project Call 
URL:https://hdpusergroup.org/event/investigate-new-test-methods-for-copper-foil-adhesion-project-call-26/
CATEGORIES:Investigate New Test Methods for Copper Foil Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260825T170000Z
DTEND:20260825T180000Z
DTSTAMP:20260921T044345
CREATED:20260818T141500Z
LAST-MODIFIED:20260818T141500Z
UID:41318-1787659200-1787662800@hdpusergroup.org
SUMMARY:Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/effect-of-metal-additions-from-final-finishes-on-solder-joint-reliability-project-call-7/
CATEGORIES:Effect of Metal Additions from Final Finishes on Solder Joint Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260826T180000Z
DTEND:20260826T190000Z
DTSTAMP:20260921T044345
CREATED:20260806T182643Z
LAST-MODIFIED:20260806T182643Z
UID:41265-1787749200-1787752800@hdpusergroup.org
SUMMARY:Pb Free Materials 7 Project Call
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/pb-free-materials-7-project-call-17/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260827T140000Z
DTEND:20260827T150000Z
DTSTAMP:20260921T044345
CREATED:20260806T145856Z
LAST-MODIFIED:20260806T145856Z
UID:41260-1787821200-1787824800@hdpusergroup.org
SUMMARY:D-Coupon IST CITC Reliability Testing
DESCRIPTION:Project Meeting 
URL:https://hdpusergroup.org/event/d-coupon-ist-citc-reliability-testing-21/
CATEGORIES:D-Coupon IST CITC Reliability Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260827T160000Z
DTEND:20260827T170000Z
DTSTAMP:20260921T044345
CREATED:20260814T170606Z
LAST-MODIFIED:20260814T170606Z
UID:41306-1787828400-1787832000@hdpusergroup.org
SUMMARY:Paste Interconnect
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/paste-interconnect-5/
CATEGORIES:Paste Interconnect
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20260827T180000Z
DTEND:20260827T190000Z
DTSTAMP:20260921T044345
CREATED:20260824T125320Z
LAST-MODIFIED:20260824T125320Z
UID:41300-1787835600-1787839200@hdpusergroup.org
SUMMARY:Non-Glass Microvias
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/non-glass-microvias-3/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR