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Calendar of Events
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Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
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3 events,
2 events,
1 event,
Glass Type Comparison
Glass Type Comparison
Historically, UL considered glass reinforcement an inert portion of the laminate composition. Glass styles were tested based on a range of thicknesses. Recently UL data showed differences in performance betw...
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1 event,
1 event,
Photonic Soldering
Photonic Soldering
Status of visual and x-ray inpsection of ATC boards
Status on drop testing
Status on FA
Progress on final report
2 events,
Copper Surface Roughness Model
Copper Surface Roughness Model
Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fi...
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4 events,
HDP Harsh Use Alloy Evaluation, Phase 4 — Kickoff Meeting
HDP Harsh Use Alloy Evaluation, Phase 4 — Kickoff Meeting
The idea for the next phase of solder joint evaluations was presented by Richard at the May member meeting. The basic objective is to characterize the board level solder joint reliability of a WLCSP package ...
4 events,
Non-glass Microvia Buildups
Non-glass Microvia Buildups
Result of AGC press experiment
Sanmina determine # of panels in a rack
Ivan's input
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2 events,
2 events,
Effects of Plating Thickness on CTF at IST Phase 2 Project Call
Effects of Plating Thickness on CTF at IST Phase 2 Project Call
Effects of Plating Thickness on CTF at IST Phase 2 Project Call
2 events,
Copper Surface Roughness Model
Copper Surface Roughness Model
Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fi...