BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20240310T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20241103T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20240801T210000Z
DTEND:20240801T220000Z
DTSTAMP:20260419T222411
CREATED:20240718T221756Z
LAST-MODIFIED:20240718T221756Z
UID:27053-1722528000-1722531600@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-2/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240801T230000Z
DTEND:20240802T000000Z
DTSTAMP:20260419T222411
CREATED:20240718T235946Z
LAST-MODIFIED:20240718T235946Z
UID:27054-1722535200-1722538800@hdpusergroup.org
SUMMARY:Porosity
DESCRIPTION:Continue working on project Definition 
URL:https://hdpusergroup.org/event/porosity-11/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240806T150000Z
DTEND:20240806T160000Z
DTSTAMP:20260419T222411
CREATED:20240723T160450Z
LAST-MODIFIED:20240723T160450Z
UID:27060-1722938400-1722942000@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Review most recent version of final report \nDiscuss possible new project 
URL:https://hdpusergroup.org/event/microvia-rel-50/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240806T170000Z
DTEND:20240806T180000Z
DTSTAMP:20260419T222411
CREATED:20240702T173253Z
LAST-MODIFIED:20240702T173253Z
UID:26930-1722945600-1722949200@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluations
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluations-3/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240807T150000Z
DTEND:20240807T160000Z
DTSTAMP:20260419T222411
CREATED:20240724T153555Z
LAST-MODIFIED:20240724T153555Z
UID:27062-1723024800-1723028400@hdpusergroup.org
SUMMARY:Sequential Lamination Mtg
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sequential-lamination-mtg-13/
CATEGORIES:Sequential Lamination
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240807T200000Z
DTEND:20240807T210000Z
DTSTAMP:20260419T222411
CREATED:20240725T203523Z
LAST-MODIFIED:20240725T203523Z
UID:27069-1723042800-1723046400@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Look at new artwork \nStatus of possible service provider 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-4/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240808T180000Z
DTEND:20240808T190000Z
DTSTAMP:20260419T222411
CREATED:20240801T180153Z
LAST-MODIFIED:20240801T180153Z
UID:27089-1723122000-1723125600@hdpusergroup.org
SUMMARY:Glass Type Comparison
DESCRIPTION:Historically\, UL considered glass reinforcement an inert portion of the laminate composition. Glass styles were tested based on a range of thicknesses. Recently UL data showed differences in performance between E-glass and Low Dk-glass. Modern circuit design trends require Low Dk-glass for microvia technology. They enable\, improved CAF resistance\, and extend the usable frequency range.PWBs are exposed to sustained and cyclic temperatures when installed in end products. Laminate RTI and PWB MOT ratings are used to mitigate risk of Fire and Electric shock. Laminates provide mechanical support\, dielectric insulation and flammability properties for the PWB to support traces and components and maintain electrical clearance and creepage spacing. Degradation and material variation investigations are important to understand the material performance does not change over time.The question is how these glass trends affect the laminate performance from a short- and long-term degradation perspective. This project will evaluate the need for additional testing of Low Dk glass types.  
URL:https://hdpusergroup.org/event/glass-type-comparison-11/
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240814T160000Z
DTEND:20240814T170000Z
DTSTAMP:20260419T222411
CREATED:20240711T203912Z
LAST-MODIFIED:20240711T203912Z
UID:27037-1723633200-1723636800@hdpusergroup.org
SUMMARY:Photonic Soldering
DESCRIPTION:Status of visual and x-ray inpsection of ATC boards \nStatus on drop testing \nStatus on FA \nProgress on final report 
URL:https://hdpusergroup.org/event/photonic-soldering-32/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240815T140000Z
DTEND:20240815T150000Z
DTSTAMP:20260419T222411
CREATED:20240711T152323Z
LAST-MODIFIED:20240711T152323Z
UID:27032-1723712400-1723716000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-33/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240815T160000Z
DTEND:20240815T170000Z
DTSTAMP:20260419T222411
CREATED:20240801T180928Z
LAST-MODIFIED:20240801T180928Z
UID:27090-1723719600-1723723200@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness.This new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs. 
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-13/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240820T150000Z
DTEND:20240820T160000Z
DTSTAMP:20260419T222411
CREATED:20240806T200935Z
LAST-MODIFIED:20240806T200935Z
UID:27042-1724148000-1724151600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Status of testing 
URL:https://hdpusergroup.org/event/better-caf-eq-40/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240820T173000Z
DTEND:20240820T183000Z
DTSTAMP:20260419T222411
CREATED:20240808T134253Z
LAST-MODIFIED:20240808T134253Z
UID:27108-1724157000-1724160600@hdpusergroup.org
SUMMARY:HDP Harsh Use Alloy Evaluation\, Phase 4 -- Kickoff Meeting
DESCRIPTION:The idea for the next phase of solder joint evaluations was presented by Richard at the May member meeting. The basic objective is to characterize the board level solder joint reliability of a WLCSP package with a matrix of high-performance solder alloys. We are now ready to have a kickoff call for this project.  
URL:https://hdpusergroup.org/event/hdp-harsh-use-alloy-evaluation-phase-4-kickoff-meeting/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240820T200000Z
DTEND:20240820T210000Z
DTSTAMP:20260419T222411
CREATED:20240815T114644Z
LAST-MODIFIED:20240815T114644Z
UID:27209-1724166000-1724169600@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Continue working on the last bit of the project \nWork on final report 
URL:https://hdpusergroup.org/event/photonic-soldering-2-24/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240821T130000Z
DTEND:20240821T133000Z
DTSTAMP:20260419T222411
CREATED:20240820T201700Z
LAST-MODIFIED:20240820T201700Z
UID:27220-1724227200-1724229000@hdpusergroup.org
SUMMARY:test
DESCRIPTION:test 
URL:https://hdpusergroup.org/event/test-7/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240821T140000Z
DTEND:20240821T150000Z
DTSTAMP:20260419T222411
CREATED:20240717T142954Z
LAST-MODIFIED:20240717T142954Z
UID:27046-1724230800-1724234400@hdpusergroup.org
SUMMARY:Reflow Cycle Via Reliability Impact Project Call
DESCRIPTION:Reflow Cycle Via Reliability Impact Project Call 
URL:https://hdpusergroup.org/event/reflow-cycle-via-reliability-impact-project-call-11/
CATEGORIES:Reflow Cycle Via Reliability Impact
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240821T150000Z
DTEND:20240821T160000Z
DTSTAMP:20260419T222411
CREATED:20240723T141018Z
LAST-MODIFIED:20240723T141018Z
UID:27059-1724234400-1724238000@hdpusergroup.org
SUMMARY:ECM-3 Meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/ecm-3-meeting-28/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T010000Z
DTEND:20240822T020000Z
DTSTAMP:20260419T222411
CREATED:20240801T020442Z
LAST-MODIFIED:20240801T020442Z
UID:27082-1724270400-1724274000@hdpusergroup.org
SUMMARY:Correlating CF Profile to Signal Integrity Project Call
DESCRIPTION:Correlating CF Profile to Signal Integrity Project Call 
URL:https://hdpusergroup.org/event/correlating-cf-profile-to-signal-integrity-project-call-4/
CATEGORIES:Correlating Copper Foil Profile to Signal Integrity
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T150000Z
DTEND:20240822T160000Z
DTSTAMP:20260419T222411
CREATED:20240725T144744Z
LAST-MODIFIED:20240725T144744Z
UID:27066-1724320800-1724324400@hdpusergroup.org
SUMMARY:Non-glass Microvia Buildups
DESCRIPTION:Result of AGC press experiment \nSanmina determine # of panels in a rack \nIvan's input 
URL:https://hdpusergroup.org/event/non-glass-microvia-buildups-14/
CATEGORIES:Non-Glass Microvia Build-ups
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T160000Z
DTEND:20240822T170000Z
DTSTAMP:20260419T222411
CREATED:20240725T152038Z
LAST-MODIFIED:20240725T152038Z
UID:27067-1724324400-1724328000@hdpusergroup.org
SUMMARY:Single Surface Finish 2 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-2-meeting-14/
CATEGORIES:Single PCB Surface Finish for Soldered & Compression Contact Pads – 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T210000Z
DTEND:20240822T220000Z
DTSTAMP:20260419T222411
CREATED:20240801T221551Z
LAST-MODIFIED:20240801T221551Z
UID:27093-1724342400-1724346000@hdpusergroup.org
SUMMARY:Glass Substrate Reliability Analysis
DESCRIPTION:Glass Substrate Reliability Analysis 
URL:https://hdpusergroup.org/event/glass-substrate-reliability-analysis-3/
CATEGORIES:Glass Substrate Reliability Analysis
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240822T230000Z
DTEND:20240823T000000Z
DTSTAMP:20260419T222411
CREATED:20240802T145531Z
LAST-MODIFIED:20240802T145531Z
UID:27095-1724349600-1724353200@hdpusergroup.org
SUMMARY:Porosity Testing
DESCRIPTION:IST update \nPhoto instructions \nWork on schedule 
URL:https://hdpusergroup.org/event/porosity-testing-2/
CATEGORIES:Porosity Testing
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240826T150000Z
DTEND:20240826T160000Z
DTSTAMP:20260419T222411
CREATED:20240729T163734Z
LAST-MODIFIED:20240729T163734Z
UID:27075-1724666400-1724670000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-50/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240827T200000Z
DTEND:20240827T210000Z
DTSTAMP:20260419T222411
CREATED:20240821T143606Z
LAST-MODIFIED:20240821T143606Z
UID:27222-1724770800-1724774400@hdpusergroup.org
SUMMARY:Photonic Soldering II
DESCRIPTION:Status of final report 
URL:https://hdpusergroup.org/event/photonic-soldering-ii-26/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240828T140000Z
DTEND:20240828T150000Z
DTSTAMP:20260419T222411
CREATED:20240726T140636Z
LAST-MODIFIED:20240726T140636Z
UID:27061-1724835600-1724839200@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Phase 2 Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Phase 2 Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-phase-2-project-call-13/
CATEGORIES:Effects of Plating Thickness on CTF at IST Phase 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240828T200000Z
DTEND:20240828T210000Z
DTSTAMP:20260419T222411
CREATED:20240821T200605Z
LAST-MODIFIED:20240821T200605Z
UID:27106-1724857200-1724860800@hdpusergroup.org
SUMMARY:Cu Outer Trace Adhesion
DESCRIPTION:Continue scoping out the project 
URL:https://hdpusergroup.org/event/cu-outer-trace-adhesion-5/
CATEGORIES:Cu Outer Trace Adhesion
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240829T150000Z
DTEND:20240829T160000Z
DTSTAMP:20260419T222411
CREATED:20240731T153940Z
LAST-MODIFIED:20240731T153940Z
UID:27080-1724925600-1724929200@hdpusergroup.org
SUMMARY:SIR Testing meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/sir-testing-meeting-23/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20240829T160000Z
DTEND:20240829T170000Z
DTSTAMP:20260419T222411
CREATED:20240815T163809Z
LAST-MODIFIED:20240815T163809Z
UID:27212-1724929200-1724932800@hdpusergroup.org
SUMMARY:Copper Surface Roughness Model
DESCRIPTION:Many of the methods used for modeling cu surface roughness are out of date. Some models being used are from the 1960s. New modleing tools include recently developed Hurray model capabilities whose results fit the measured values well– assuming one knows what Hurray Parameters to input. Determining the appropriate Hurray model depends on structure and roughness values\, as each copper surface can have different roughness.This new tool lacks validation. The question remains if the modeling tool provides adequate sensitivity and is applicable across a wide range of copper foils\, oxide treatments\, materials\, and transmission line structures. This project will develop a plan to demonstrate/verify that real world inputs into the tool provide a good prediction of future results without post analysis and tweaking of the inputs.  
URL:https://hdpusergroup.org/event/copper-surface-roughness-model-14/
CATEGORIES:Cu Surface Rougness Model
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR