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Calendar of Events
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Effects of Plating Thickness on CTF at IST Phase 2 Project Call
Effects of Plating Thickness on CTF at IST Phase 2 Project Call
Effects of Plating Thickness on CTF at IST Phase 2 Project Call
3 events,
0 events,
0 events,
0 events,
2 events,
2 events,
3 events,
Idea discussion: Glass substrates for IC packages
Idea discussion: Glass substrates for IC packages
Idea discussion: Glass substrates for IC packages (Please bring any shareable information with us)
0 events,
0 events,
1 event,
1 event,
3 events,
Effects of Plating Thickness on CTF at IST Phase 2 Project Call
Effects of Plating Thickness on CTF at IST Phase 2 Project Call
Effects of Plating Thickness on CTF at IST Phase 2 Project Call
NEW PROJECT – Outer Trace Adhesion
NEW PROJECT – Outer Trace Adhesion
HDP recently completed a project about the adhesion strength of inner layer copper traces. This new project proposes to investigate and validate a quantitative test method for determining the adhesion ...
2 events,
Dry run with linked agenda and final presentations
Dry run with linked agenda and final presentations
Dry run on linked presentations and final copies and ID of presenters.
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0 events,
0 events,
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2 events,
Internet and AV check at Co-Tech for Member Meeting
Internet and AV check at Co-Tech for Member Meeting
Internet and AV check at Co-Tech for Member Meeting
HDP May Asia 2024 Member Meeting
HDP May Asia 2024 Member Meeting
The HDP May 2024 Asia Meeting will be held on May 22 & 23, 2024 (Taiwan Time) / May 21 & 22 (US Time) in Taipei, Taiwan. The meeting will be hosted by Co-Tech. Members can register for t...
1 event,
HDP May Asia 2024 Member Meeting
HDP May Asia 2024 Member Meeting
The HDP May 2024 Asia Meeting will be held on May 22 & 23, 2024 (Taiwan Time) / May 21 & 22 (US Time) in Taipei, Taiwan. The meeting will be hosted by Co-Tech. Members can register for t...
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1 event,
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4 events,
4 events,
External Copper Trace Adhesion
External Copper Trace Adhesion
Continue to explore the possilbility of making this idea an HDP project