News Releases

October 17, 2018

HDP User Group Announces New Project Idea Call – High Density BGA

High Density Packaging (HDP) User Group is pleased to announce a New Project Idea Call – High Density BGA. Pin Count on BGAs is increasing because […]
September 12, 2018

HDP User Group Announces New Member

High Density Packaging (HDP) User Group is pleased to announce that Elec & Eltek PCB has become a member. “All good shows crave to benefit an […]
January 26, 2018

HDP User Group Announces VeCS Project

High Density Packaging (HDP) User Group is pleased to announce new VeCS Project. High Density Packaging User Group is starting a project to evaluate Vertical Conductive […]
April 26, 2017

HDP User Group Announces New Project

The initiation of a new project that is open for industry participation, CAF TV for Material Characterization. “Conductive Anodic Filamentation (CAF) manifests as an abrupt unpredictable loss of insulation resistance in electronic circuits during use. This project will focus on material screening to assess susceptibility before the material is used to build product” said Alun Morgan project facilitator. 
April 11, 2017

HDP User Group Announces New Industry Wide Projects

High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce the initiation of four new projects which are open for industry participation. “HDP User Group projects are based on problems and ideas our members bring forward. HDP has members on all tiers of the supply chain, which translates into solutions that the industry can implement quickly”, said Marshall Andrews Executive Director of the organization.