News Releases

January 26, 2018

HDP User Group Announces VeCS Project

High Density Packaging (HDP) User Group is pleased to announce new VeCS Project. High Density Packaging User Group is starting a project to evaluate Vertical Conductive […]
April 26, 2017

HDP User Group Announces New Project

The initiation of a new project that is open for industry participation, CAF TV for Material Characterization. “Conductive Anodic Filamentation (CAF) manifests as an abrupt unpredictable loss of insulation resistance in electronic circuits during use. This project will focus on material screening to assess susceptibility before the material is used to build product” said Alun Morgan project facilitator. 
April 11, 2017

HDP User Group Announces New Industry Wide Projects

High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce the initiation of four new projects which are open for industry participation. “HDP User Group projects are based on problems and ideas our members bring forward. HDP has members on all tiers of the supply chain, which translates into solutions that the industry can implement quickly”, said Marshall Andrews Executive Director of the organization.
February 1, 2017

HDP User Group Completes Press-Fit Rework Project

More and more products use electronic devices to communicate. In 2020 it is expected that there will be more than 50 billion connected devices in the world. This means that many electronic products, especially mobile base stations and core network nodes, need to handle enormous amount of data per second. One important link in this communication chain are high speed press fit connectors that are often used to connect mother boards and back planes in core network nodes.
November 10, 2016

HDP User Group Announces New High Frequency Measurement Project

As electronic products increase in functionality and interconnect speeds approach 40 GB/sec, the need to measure substrate material performance becomes increasingly important and demanding. This is the third project in this series.Phase one reviewed and compared the different types of high frequency test measurements that are used in the industry for measuring Dielectric Constant(Dk) and Dissapation factor(Df) at higher frequencies. Moisture content was identified as a significant factor in the testing.