High Density Packaging (HDP) User Group is pleased to announce new VeCS Project.
High Density Packaging User Group is starting a project to evaluate Vertical Conductive Structures – VeCS. VeCS is a relatively new patented technology by NextGIn Technology for creating a higher density of connections to the internal layers and with less distortion of the signal. The technology allows for less cutting of the ground/power planes for a better current carrying capacity and better reference plane for the striplines. The project will evaluate the reliability and signal integrity aspects of this technology as it pertains to our members technology interest.
To receive additional information about, or to join this project, please contact the project facilitator John Davignon, email@example.com.