High Density Packaging (HDP) User Group is pleased to announce a New Project Idea Call – High Density BGA.
Pin Count on BGAs is increasing because of high speed signal isolation strategies and more complex processor devices. The BGA body size increases impact on placement efficiency, performance, and package warpage and reliability.
This project will explore using finer pitch BGAs thus keeping body size smaller and changing the PCB escape line width and spacing technologies.
This is the initial idea call and your input and participation is welcome. For call in information please email Larrym@HDPUG.org
About HDP User Group
HDP User Group (www.hdpug.org) is a global research and development organization based in Cave Creek Arizona, is dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. HDP User Group maintains additional offices in Austin, Texas, and Singapore.