Cave Creek, Arizona September 21, 2015. The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce its sponsorship of a free Webinar that will provide the latest findings on Tin Whiskers in Electronics.
The NASA tin (Sn) whisker web site describes Sn whiskers as electrically conductive, crystalline structures of tin that sometimes grow from surfaces where tin (especially electroplated tin) is used as a final finish. Numerous electronic system failures have been attributed to short circuits caused by tin whiskers that bridge closely-spaced circuit elements maintained at different electrical potentials.
Dave Love, Project Facilitator for HDP User Group states “The purpose of this Webinar is to share recent developments regarding tin whiskers, particularly with respect to the use of SAC solders. Topics to be covered include whisker growth mechanisms, real life failure histories, and whisker mitigation strategies.”
Top people in the field will give presentations and participate in a short Q&A session at the end of the webinar. The Q&A session will use questions submitted by email. Only the panel will be unmuted.
If you miss the webinar, don't worry! A recording will be made available.
Thanks to the following co-sponsors for their support: SMTA, IPC, EIPC, SEMI, CALCE, and MEPTEC.
To register for the Webinar, the Direct link for registration is:http://www.smta.org/education/registration/event_registration.cfm?event_... or contact David Love.
Send questions before the meeting to firstname.lastname@example.org for the Q&A session.
For more information, visit HDP User Group on the Internet at www.hdpug.org or contact Darryl Reiner.