Cave Creek, Arizona March 21, 2016. The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce that MacDermid Enthone Electronics Solutions has become a member.
“We are very interested in collaborating with other member companies, working together to overcome the technological challenges of next generation electronics, and providing high performance materials solutions for several of the HDP project programs.” said Michael Coll, Director of Electronics Specialties for MacDermid Enthone Electronics Solutions. MacDermid Enthone is a part of the MacDermid Performance Solutions group of businesses.
“MacDermid Enthone Electronics Solutions is the newest member of HDP User Group. MacDermid Enthone has a long history of delivering advanced technologies to the industry. We welcome their participation in our Smooth Copper Signal Integrity project which is studying the relationship between surface roughness measurements and Insertion Loss of various copper surface finish treatments”, said Marshall Andrews, Executive Director of HDP User Group.
As a Member, MacDermid Enthone will join over 50 of the major companies involved in the design and manufacturing of electronic products worldwide in addressing the major technical and environmental issues facing the industry today. Their participation will complement the other member companies and help keep HDP User Group technical projects moving forward.