Cave Creek, Arizona June 3, 2015. The High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce that i3 Electronics, Inc. has become a member.
“We are very interested in collaborating with other member companies and providing enabling high performance interconnect solutions to several of the HDP programs.” said Frank Egitto, Director of Research and Development for i3.
“i3 Electronics is the newest member of HDP User Group. i3 has a long history of delivering advanced technologies to the industry. We welcome their participation in our Mini-Power Cycle project which is studying the reliability impact of frequent off-and-on operation seen in many electronics products today”, said Marshall Andrews, Executive Director of HDP User Group.
As a Member, i3 Electronics will join over 50 of the major companies involved in the design and manufacturing of electronic products worldwide in addressing the major technical and environmental issues facing the industry today. Their participation will complement the other member companies and help keep HDP User Group technical projects moving forward.