Call with ASKPCB

Meeting

Thin Dielectric Skew Project Kickoff

Develop a test method which can measure the propensity of poor soldermask coverage to corrosion.

Meeting

D-Coupon IST CITC Reliability Testing - Standard test method vs Actual PCBA reflow profiles

Project goal is to develop a CAD translator utility that will provide analysis of local copper distribution to identify risk areas for core deformation and backdrill stub variation, surface topography variat...

Component sizes are climbing – 90 x 100, 100 x 100, even 165 x 165 mm2.  Current no-clean flux chemistries may not meet the requirements of all OEMs/customers. How is our industry going to deal wi...

Introductory Call with Circuitfoil 

Meeting

Testing New Outlook and ics files with Larry

Glass "components" Non-members who should be invited Team leader

Testing distribution list w 5 emails.

Meeting

Need confirmation from Dan that these settings work.