Innerlayer Copper Balancing

Periodic Project Call

Meeting

Call to discuss project results

Possible test houses What exactly will we tackle that will be different than other ventures?

Updates from Hubert and Jason

Review draft submission of document for going to Implementation to be sent to the BoD 

Effects of Plating Thickness on CTF at IST Project Call

Final Finish Layer Deposits for High Frequency

Reduced Cost CAF telecom

Had to move due to Joe's availability. Discuss data and final report

High Speed Hybrid PWB Project Call

Backdrill Transition Telecom

Status of board build and thermocupling

Meeting

Results of intial testing

Periodic Project Call

Update from Wallace

Meeting

Continue working on defining the project

Final Finish Layer Deposits for High Frequency

Meeting

Updates from Hubert and Jason

Call to discuss outliers in data

Update from Ara

Project Call

Innerlayer Copper Balancing telecom

Periodic project call

Last chance for getting participants for high voltage testing? If no participants, then move to Phase 2 (low voltage testing).

Reduced Cost CAF telecom

Meeting

Updates from Jason and Hubert

Meeting

All samples should have complleted initial manufacture. All samples requiring etching should have reached Jenny Jenny and Sarah will have completed more testing

Effects of Plating Thickness on CTF at IST Project Call

Discuss whether or not to continue projet