BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//HDP User Group - ECPv6.10.1.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://hdpusergroup.org
X-WR-CALDESC:Events for HDP User Group
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
TZNAME:CDT
DTSTART:20220313T080000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
TZNAME:CST
DTSTART:20221106T070000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART:20220801T160000Z
DTEND:20220801T170000Z
DTSTAMP:20260421T165144
CREATED:20220719T123553Z
LAST-MODIFIED:20220719T123553Z
UID:22951-1659351600-1659355200@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing
DESCRIPTION:Innerlayer Copper Balancing 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-6/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220802T170000Z
DTEND:20220802T180000Z
DTSTAMP:20260421T165144
CREATED:20220706T181214Z
LAST-MODIFIED:20220706T181214Z
UID:22905-1659441600-1659445200@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluation Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluation-project-call-8/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220803T150000Z
DTEND:20220803T160000Z
DTSTAMP:20260421T165144
CREATED:20220720T160907Z
LAST-MODIFIED:20220720T160907Z
UID:22965-1659520800-1659524400@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-4/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220803T180000Z
DTEND:20220803T190000Z
DTSTAMP:20260421T165144
CREATED:20220720T122829Z
LAST-MODIFIED:20220720T122829Z
UID:22958-1659531600-1659535200@hdpusergroup.org
SUMMARY:Glass type composition Project call
DESCRIPTION:Call to discuss project results 
URL:https://hdpusergroup.org/event/glass-type-composition-project-call/
LOCATION:Virtual
CATEGORIES:Glass Type Composition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220804T130000Z
DTEND:20220804T140000Z
DTSTAMP:20260421T165144
CREATED:20220728T184648Z
LAST-MODIFIED:20220728T184648Z
UID:22983-1659600000-1659603600@hdpusergroup.org
SUMMARY:SIR Next Ev
DESCRIPTION:Possible test houses \nWhat exactly will we tackle that will be different than other ventures? 
URL:https://hdpusergroup.org/event/sir-next-ev/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220804T140000Z
DTEND:20220804T150000Z
DTSTAMP:20260421T165144
CREATED:20220803T192955Z
LAST-MODIFIED:20220803T192955Z
UID:23014-1659603600-1659607200@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Hubert and Jason 
URL:https://hdpusergroup.org/event/better-caf-eq-19/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220804T190000Z
DTEND:20220804T200000Z
DTSTAMP:20260421T165144
CREATED:20220728T192210Z
LAST-MODIFIED:20220728T192210Z
UID:22984-1659621600-1659625200@hdpusergroup.org
SUMMARY:Microvia Reliability
DESCRIPTION:Review draft submission of document for going to Implementation to be sent to the BoD  
URL:https://hdpusergroup.org/event/microvia-reliability-3/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220805T140000Z
DTEND:20220805T150000Z
DTSTAMP:20260421T165144
CREATED:20220711T153250Z
LAST-MODIFIED:20220711T153250Z
UID:22922-1659690000-1659693600@hdpusergroup.org
SUMMARY:Effects of Plating Thickness on CTF at IST Project Call
DESCRIPTION:Effects of Plating Thickness on CTF at IST Project Call 
URL:https://hdpusergroup.org/event/effects-of-plating-thickness-on-ctf-at-ist-project-call-15/
CATEGORIES:Effects of Plating Thickness on Cycles to Failure at IST
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220808T150000Z
DTEND:20220808T160000Z
DTSTAMP:20260421T165144
CREATED:20220711T155539Z
LAST-MODIFIED:20220711T155539Z
UID:22923-1659952800-1659956400@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-8/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220809T150000Z
DTEND:20220809T160000Z
DTSTAMP:20260421T165144
CREATED:20220801T163846Z
LAST-MODIFIED:20220801T163846Z
UID:22994-1660039200-1660042800@hdpusergroup.org
SUMMARY:Reduced Cost CAF telecom
DESCRIPTION:Reduced Cost CAF telecom 
URL:https://hdpusergroup.org/event/reduced-cost-caf-telecom-3/
CATEGORIES:Reduced Cost CAF
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220809T160000Z
DTEND:20220809T170000Z
DTSTAMP:20260421T165144
CREATED:20220728T220220Z
LAST-MODIFIED:20220728T220220Z
UID:22990-1660042800-1660046400@hdpusergroup.org
SUMMARY:Cu Surface Treatment vs Loss
DESCRIPTION:Had to move due to Joe's availability. \nDiscuss data and final report 
URL:https://hdpusergroup.org/event/cu-surface-treatment-vs-loss-2/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220810T010000Z
DTEND:20220810T020000Z
DTSTAMP:20260421T165144
CREATED:20220804T080155Z
LAST-MODIFIED:20220804T080155Z
UID:22770-1660075200-1660078800@hdpusergroup.org
SUMMARY:High Speed Hybrid PWB Project Call
DESCRIPTION:High Speed Hybrid PWB Project Call 
URL:https://hdpusergroup.org/event/high-speed-hybrid-pwb-project-call-42/
CATEGORIES:High Speed Hybrid PWB
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220810T160000Z
DTEND:20220810T170000Z
DTSTAMP:20260421T165144
CREATED:20220802T194020Z
LAST-MODIFIED:20220802T194020Z
UID:22952-1660129200-1660132800@hdpusergroup.org
SUMMARY:Backdrill Transition Telecom
DESCRIPTION:Backdrill Transition Telecom 
URL:https://hdpusergroup.org/event/backdrill-transition-telecom/
CATEGORIES:Back drill to Primary via Transition
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220811T130000Z
DTEND:20220811T140000Z
DTSTAMP:20260421T165144
CREATED:20220728T131545Z
LAST-MODIFIED:20220728T131545Z
UID:22979-1660204800-1660208400@hdpusergroup.org
SUMMARY:Photo Soldering 2
DESCRIPTION:Status of board build and thermocupling 
URL:https://hdpusergroup.org/event/photo-soldering-2/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220811T140000Z
DTEND:20220811T150000Z
DTSTAMP:20260421T165144
CREATED:20220721T142931Z
LAST-MODIFIED:20220721T142931Z
UID:22967-1660208400-1660212000@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/july-21-1000-am-1100-am-edt-single-surface-finish-meeting/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220811T160000Z
DTEND:20220811T170000Z
DTSTAMP:20260421T165144
CREATED:20220720T170759Z
LAST-MODIFIED:20220720T170759Z
UID:22966-1660215600-1660219200@hdpusergroup.org
SUMMARY:TA Method
DESCRIPTION:Results of intial testing 
URL:https://hdpusergroup.org/event/ta-method-3/
CATEGORIES:Thermal Analysis Methodolgy Assessment
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220812T170000Z
DTEND:20220812T180000Z
DTSTAMP:20260421T165144
CREATED:20220801T174249Z
LAST-MODIFIED:20220801T174249Z
UID:23002-1660305600-1660309200@hdpusergroup.org
SUMMARY:Ultra-Low Dk Glass Analysis Project Call
DESCRIPTION:Periodic Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-call-6/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220817T140000Z
DTEND:20220817T150000Z
DTSTAMP:20260421T165144
CREATED:20220808T144411Z
LAST-MODIFIED:20220808T144411Z
UID:23023-1660726800-1660730400@hdpusergroup.org
SUMMARY:ECM3
DESCRIPTION:Update from Wallace 
URL:https://hdpusergroup.org/event/ecm3/
CATEGORIES:ECM 3
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220817T150000Z
DTEND:20220817T160000Z
DTSTAMP:20260421T165144
CREATED:20220809T150156Z
LAST-MODIFIED:20220809T150156Z
UID:23034-1660730400-1660734000@hdpusergroup.org
SUMMARY:Materials #7 meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/materials-7-meeting-5/
CATEGORIES:Materials #7
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220818T180000Z
DTEND:20220818T190000Z
DTSTAMP:20260421T165144
CREATED:20220811T134132Z
LAST-MODIFIED:20220811T134132Z
UID:23050-1660827600-1660831200@hdpusergroup.org
SUMMARY:Cu Peel Strength 2
DESCRIPTION:Review progress including pwb build 
URL:https://hdpusergroup.org/event/cu-peel-strength-2/
CATEGORIES:Staff Calendar
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220818T200000Z
DTEND:20220818T210000Z
DTSTAMP:20260421T165144
CREATED:20220809T173712Z
LAST-MODIFIED:20220809T173712Z
UID:23036-1660834800-1660838400@hdpusergroup.org
SUMMARY:Microvia Rel
DESCRIPTION:Continue working on defining the project 
URL:https://hdpusergroup.org/event/microvia-rel-15/
CATEGORIES:Microvia Reliability
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220822T150000Z
DTEND:20220822T160000Z
DTSTAMP:20260421T165144
CREATED:20220808T153320Z
LAST-MODIFIED:20220808T153320Z
UID:23024-1661162400-1661166000@hdpusergroup.org
SUMMARY:Final Finish Layer Deposits for High Frequency
DESCRIPTION:Final Finish Layer Deposits for High Frequency 
URL:https://hdpusergroup.org/event/final-finish-layer-deposits-for-high-frequency-9/
CATEGORIES:Final Finish Layer Deposits for High Frequency
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220824T150000Z
DTEND:20220824T160000Z
DTSTAMP:20260421T165144
CREATED:20220811T144133Z
LAST-MODIFIED:20220811T144133Z
UID:23051-1661335200-1661338800@hdpusergroup.org
SUMMARY:Single Surface Finish meeting
DESCRIPTION:Meeting 
URL:https://hdpusergroup.org/event/single-surface-finish-meeting-15/
CATEGORIES:Single Surface Finish for Soldered & Compression
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220825T140000Z
DTEND:20220825T150000Z
DTSTAMP:20260421T165144
CREATED:20220809T173533Z
LAST-MODIFIED:20220809T173533Z
UID:23035-1661418000-1661421600@hdpusergroup.org
SUMMARY:Better CAF Eq
DESCRIPTION:Updates from Hubert and Jason 
URL:https://hdpusergroup.org/event/better-caf-eq-20/
CATEGORIES:Better CAF Acceleration Equation
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220825T160000Z
DTEND:20220825T170000Z
DTSTAMP:20260421T165144
CREATED:20220811T194714Z
LAST-MODIFIED:20220811T194714Z
UID:23055-1661425200-1661428800@hdpusergroup.org
SUMMARY:Copper Surface Treatment vs Loss Project C all
DESCRIPTION:Call to discuss outliers in data 
URL:https://hdpusergroup.org/event/copper-surface-treatment-vs-loss-project-c-all/
CATEGORIES:Cu Grain Structure
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220825T190000Z
DTEND:20220825T200000Z
DTSTAMP:20260421T165144
CREATED:20220811T130926Z
LAST-MODIFIED:20220811T130926Z
UID:23048-1661436000-1661439600@hdpusergroup.org
SUMMARY:Photonic Soldering 2
DESCRIPTION:Update from Ara 
URL:https://hdpusergroup.org/event/photonic-soldering-2-9/
CATEGORIES:Photonic Soldering 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220826T170000Z
DTEND:20220826T180000Z
DTSTAMP:20260421T165144
CREATED:20220817T144426Z
LAST-MODIFIED:20220817T144426Z
UID:23074-1661515200-1661518800@hdpusergroup.org
SUMMARY:Ultra Low Dk Glass Analysis Project
DESCRIPTION:Project Call 
URL:https://hdpusergroup.org/event/ultra-low-dk-glass-analysis-project-8/
CATEGORIES:Glass Weave
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220829T160000Z
DTEND:20220829T170000Z
DTSTAMP:20260421T165144
CREATED:20220822T171909Z
LAST-MODIFIED:20220822T171909Z
UID:22993-1661770800-1661774400@hdpusergroup.org
SUMMARY:Innerlayer Copper Balancing telecom
DESCRIPTION:Innerlayer Copper Balancing telecom 
URL:https://hdpusergroup.org/event/innerlayer-copper-balancing-telecom-18/
CATEGORIES:Local Copper Density
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220830T170000Z
DTEND:20220830T180000Z
DTSTAMP:20260421T165144
CREATED:20220808T125309Z
LAST-MODIFIED:20220808T125309Z
UID:23019-1661860800-1661864400@hdpusergroup.org
SUMMARY:Harsh Use Alloy Evaluations Project Call
DESCRIPTION:Periodic project call 
URL:https://hdpusergroup.org/event/harsh-use-alloy-evaluations-project-call/
CATEGORIES:Harsh Use Alloy Evaluation 2
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
BEGIN:VEVENT
DTSTART:20220831T130000Z
DTEND:20220831T140000Z
DTSTAMP:20260421T165144
CREATED:20220804T134921Z
LAST-MODIFIED:20220804T134921Z
UID:23017-1661932800-1661936400@hdpusergroup.org
SUMMARY:SIR Next Ev
DESCRIPTION:Last chance for getting participants for high voltage testing? \nIf no participants\, then move to Phase 2 (low voltage testing). 
URL:https://hdpusergroup.org/event/sir-next-ev-2/
CATEGORIES:Surface Insulation Resistance (SIR) Testing the Next Evolution
ORGANIZER;CN=HDP:mailto:webmaster@hdpug.org
END:VEVENT
END:VCALENDAR