35 events found.
Calendar of Events
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D-Coupon IST CITC Reliability Testing Project
D-Coupon IST CITC Reliability Testing Project
Evaluate how typical D-Coupon, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used.
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Non-Glass Microvia Build-ups
Non-Glass Microvia Build-ups
Update from Sabmina
Go over first draft of presentation for Members' Meetting
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Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
Investigate New Test Methods for Copper Foil Adhesion Project Call
3 events,
Inner Layer Copper Balancing 2
Inner Layer Copper Balancing 2
This project seeks to develop a CAD translator utility for members that will provide analysis of local copper distribution to identify risk areas for: Core deformation and backdrill stub variation; Surface T...
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
3 events,
TCE Materials-CTE Method validation
TCE Materials-CTE Method validation
There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However, the hypothesis is that better dimensional properties of laminates in the X-Y axis is equally critic...
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D-Coupon IST CITC Reliability Testing Project
D-Coupon IST CITC Reliability Testing Project
Evaluate how typical D-Coupon, IST and CITC reliability test results can vary in relationship to the actual board assembly reflow profile used.