Correlating CF Profile to Signal Integrity Project Call
Correlating CF Profile to Signal Integrity Project Call
- Have any questions?
- info@hdpug.org
4 events found.
HDP User Group
Events from this organizer
Materials #7 meeting
Meeting
D Coupon/IST/CITC Reliability Testing
Printed circuit board through-hole via and microvia reliability are continuing concerns in the electronics industry. The industry is using smaller and higher aspect ratio vias and […]
TCE materials-validating test methods for X-Y CTE
There has been multiple studies related to the TCE of laminate materials as related to the Z-axis. However, the hypothesis is that better dimensional properties of […]