News Releases
February 1, 2017
More and more products use electronic devices to communicate. In 2020 it is expected that there will be more than 50 billion connected devices in the world. This means that many electronic products, especially mobile base stations and core network nodes, need to handle enormous amount of data per second. One important link in this communication chain are high speed press fit connectors that are often used to connect mother boards and back planes in core network nodes.
November 10, 2016
As electronic products increase in functionality and interconnect speeds approach 40 GB/sec, the need to measure substrate material performance becomes increasingly important and demanding.
This is the third project in this series.Phase one reviewed and compared the different types of high frequency test measurements that are used in the industry for measuring Dielectric Constant(Dk) and Dissapation factor(Df) at higher frequencies. Moisture content was identified as a significant factor in the testing.
November 1, 2016
The current industry standard test protocols were originally developed to identify highly ionic contaminant levels (halides) after a cleaning process. These test protocols are not completely effective at identifying ECM exposures from no-clean flux residues.
November 1, 2016
“We are pleased to have Bev Christian join the facilitator team at HDP. He brings years of experience in Electronics Assembly and Reliability Assessment. Bev’s skills in program management and background in PWB manufacturing, assembly, and testing will be a big asset to our PWB focused project segment” said Marshall Andrews Executive Director of HDP user group.
July 12, 2016
RBP Chemical Technology was founded in 1954. RBP develops, manufactures and specialty chemicals and processes used in the fabrication of printed circuit boards, semiconductors and IC substrates. Company expertise resides in surface preparation, metallization, circuit formation, HDI, solderability enhancement and processes for TSV and RDL. Further emphasis on processes to enhance signal integrity and long-term reliability.