News Releases
March 26, 2019
High Density Packaging (HDP) User Group is pleased to announce that Akrometrix has become a member. “As an HDP User Group member, Akrometrix is exposed to […]
October 17, 2018
High Density Packaging (HDP) User Group is pleased to announce a New Project Idea Call – High Density BGA. Pin Count on BGAs is increasing because […]
September 12, 2018
High Density Packaging (HDP) User Group is pleased to announce that Elec & Eltek PCB has become a member. “All good shows crave to benefit an […]
January 26, 2018
High Density Packaging (HDP) User Group is pleased to announce new VeCS Project. High Density Packaging User Group is starting a project to evaluate Vertical Conductive […]
April 26, 2017
The initiation of a new project that is open for industry participation, CAF TV for Material Characterization. “Conductive Anodic Filamentation (CAF) manifests as an abrupt unpredictable loss of insulation resistance in electronic circuits during use. This project will focus on material screening to assess susceptibility before the material is used to build product” said Alun Morgan project facilitator.