News Releases
October 23, 2014
The High Density Packaging (HDP) User Group headquartered in the United States announces the Smooth Copper Signal Integrity project which is focused on evaluating the effects of processing smooth copper foil for Printed Circuit Boards (PCBs) and the roughness on all sides of a trace produced when the circuits are fabricated. It will also evaluate the variation caused by etch chemistry/oxide chemistry and just as critical, the methods of roughness measurement.
January 13, 2014
The organization was founded in 1993 and has been in continuous operation since then.
The foundation of HDP User Group is multi-company cooperation on technical issues of common concern to its members such as characterization of new packaging concepts with respect to reliability and technical performance.
January 6, 2014
Polar Instruments is a provider of signal integrity tools and high-speed test equipment and services. Headquartered in Great Britain, Polar Instruments has a 40+ year history of providing advance design, test, and repair technology to the electronics industry.
May 8, 2013
Concerns over the potential release of harmful by products from electronic products containing halogenated flame retardant (HFRs) when those products are improperly disposed of, has led many of the major global computer manufacturers to begin phasing out HFRs, including bromine, chlorine and materials containing these elements, such as Poly Vinyl Chloride (PVC). HDP User Group members are proactively looking for replacements for these materials in cables which are used in all electronics hardware. In the first Halogen Free Cables Project, HDP User Group completed a study that compared technical performance of HFR-free replacement materials that could be used in cable products.
May 1, 2013
EMC is committed to developing innovative Printed Circuit Board (PCB) base materials with its halogen-free technology which are in line with future market demand and customer requirements, such as ultra-thin core, ultra high thermal conductivity material, IC substrate base material and mid loss, low loss and ultra-low loss high speed materials.