News Releases
May 1, 2013
EMC is committed to developing innovative Printed Circuit Board (PCB) base materials with its halogen-free technology which are in line with future market demand and customer requirements, such as ultra-thin core, ultra high thermal conductivity material, IC substrate base material and mid loss, low loss and ultra-low loss high speed materials.
March 19, 2013
Kyzen Corporation was founded in 1990. Kyzen was among the first to invent novel and environmentally friendly cleaning technologies to replace CFC’s and other ozone depleting chemicals. These cleaning technologies are derived from renewable resources and offer an innovative and environmentally friendly cleaning solution to the Electronics, Semiconductor, Optics and Metal Finishing markets.
March 6, 2013
Sekisui Chemical Co., Ltd. is a premier materials supplier to the global LCD and Semiconductor, markets. Sekisui has developed and markets a plastic core solder ball known as Micropearl SOL, which is widely used in various package applications. Other products include solder materials, conductive fine particles, intermediate films for laminated glass, foamed polyolefin, double-faced tapes, industrial resins and films, optical films, inspection chemicals, medical equipment, packing tapes, adhesives and plastic containers.
January 2, 2013
Indium Corporation manufactures materials for package-on-package, flip-chip, 2.5D and 3D semiconductor assembly, and advanced SMT assembly processes, including semiconductor grade fluxes and solder paste, die-attach wire, and specialty solder spheres.
