Cave Creek, Arizona May 1, 2013. The High Density Packaging (HDP) User Group headquartered in the United States announces that Elite Material Co., Ltd. (EMC) has become its newest member.

EMC is committed to developing innovative Printed Circuit Board (PCB) base materials with its halogen-free technology which are in line with future market demand and customer requirements, such as ultra-thin core, ultra high thermal conductivity material, IC substrate base material and mid loss, low loss and ultra-low loss high speed materials.

Albert Tung, President for EMC said “We are proud to be a member of HDPUG that will facilitate our work with global OEMs and PCBs to develop the most cost effective and innovative solutions for the electronic industry.”

Marshall Andrews Executive Director of HDP User Group said “We are pleased to announce that EMC, one of the premier high tech printed circuit material suppliers has joined our consortium. They are participating in several of our new technology programs, including “High Frequency Measurement”, which is looking at a uniform test procedure for high speed PWB materials and “Pad Cratering” which is evaluating test methods to detect this phenomenon. They are also contributors to our “PWB Materials Reliability” project focused on evaluation of next generation high performance laminates and pre-pregs.”