September 9, 2020
Cave Creek, Arizona September 9, 2020. High-Density Packaging (HDP) User Group is pleased to announce it is hosting a free webinar that will provide its members […]
June 24, 2020
Cave Creek, AZ, USA, June 24, 2020 – IPC and High Density Package Users Group (HDP), a trade organization representing companies involved in the supply chain […]
May 19, 2020
Cave Creek, Arizona May 19, 2020. High-Density Packaging (HDP) User Group is pleased to announce it is hosting a webinar that will provide its members and […]
August 27, 2019
Cave Creek, Arizona July 25, 2019. High Density Packaging (HDP) User Group is pleased to announce that Gen3 has become our newest member. “We are very […]
April 2, 2019
High Density Packaging (HDP) User Group is pleased to announce that Firan Technology Group Corporation (FTG) has become a member. “FTG has consistently looked to understand […]
March 26, 2019
High Density Packaging (HDP) User Group is pleased to announce that Akrometrix has become a member. “As an HDP User Group member, Akrometrix is exposed to […]
October 17, 2018
High Density Packaging (HDP) User Group is pleased to announce a New Project Idea Call – High Density BGA. Pin Count on BGAs is increasing because […]
September 12, 2018
High Density Packaging (HDP) User Group is pleased to announce that Elec & Eltek PCB has become a member. “All good shows crave to benefit an […]
January 26, 2018
High Density Packaging (HDP) User Group is pleased to announce new VeCS Project. High Density Packaging User Group is starting a project to evaluate Vertical Conductive […]
April 26, 2017
The initiation of a new project that is open for industry participation, CAF TV for Material Characterization. “Conductive Anodic Filamentation (CAF) manifests as an abrupt unpredictable loss of insulation resistance in electronic circuits during use. This project will focus on material screening to assess susceptibility before the material is used to build product” said Alun Morgan project facilitator.
April 11, 2017
High Density Packaging (HDP) User Group headquartered in the United States is pleased to announce the initiation of four new projects which are open for industry participation. “HDP User Group projects are based on problems and ideas our members bring forward. HDP has members on all tiers of the supply chain, which translates into solutions that the industry can implement quickly”, said Marshall Andrews Executive Director of the organization.
February 1, 2017
More and more products use electronic devices to communicate. In 2020 it is expected that there will be more than 50 billion connected devices in the world. This means that many electronic products, especially mobile base stations and core network nodes, need to handle enormous amount of data per second. One important link in this communication chain are high speed press fit connectors that are often used to connect mother boards and back planes in core network nodes.
November 10, 2016
As electronic products increase in functionality and interconnect speeds approach 40 GB/sec, the need to measure substrate material performance becomes increasingly important and demanding. This is the third project in this series.Phase one reviewed and compared the different types of high frequency test measurements that are used in the industry for measuring Dielectric Constant(Dk) and Dissapation factor(Df) at higher frequencies. Moisture content was identified as a significant factor in the testing.
November 1, 2016
The current industry standard test protocols were originally developed to identify highly ionic contaminant levels (halides) after a cleaning process. These test protocols are not completely effective at identifying ECM exposures from no-clean flux residues.
November 1, 2016
“We are pleased to have Bev Christian join the facilitator team at HDP. He brings years of experience in Electronics Assembly and Reliability Assessment. Bev’s skills in program management and background in PWB manufacturing, assembly, and testing will be a big asset to our PWB focused project segment” said Marshall Andrews Executive Director of HDP user group.
July 12, 2016
RBP Chemical Technology was founded in 1954. RBP develops, manufactures and specialty chemicals and processes used in the fabrication of printed circuit boards, semiconductors and IC substrates. Company expertise resides in surface preparation, metallization, circuit formation, HDI, solderability enhancement and processes for TSV and RDL. Further emphasis on processes to enhance signal integrity and long-term reliability.
March 21, 2016
MacDermid Performance Solutions is a subsidiary of Platform Specialty Products Corporation. Our companies manufacture a broad range of specialty chemicals and materials which are used in multi-step technological processes that enhance the products people use every day. Our innovative materials and processes are creating more opportunities and efficiencies for companies across key industries – including electronics, graphic arts, metal & plastic plating, and offshore oil production.
September 1, 2015
Sponsorship of a free Webinar that will provide the latest findings on Tin Whiskers in Electronics. The NASA tin (Sn) whisker web site describes Sn whiskers as electrically conductive, crystalline structures of tin that sometimes grow from surfaces where tin (especially electroplated tin) is used as a final finish. Numerous electronic system failures have been attributed to short circuits caused by tin whiskers that bridge closely-spaced circuit elements maintained at different electrical potentials.
June 3, 2015
i3 Electronics, Inc. is a world leader in high-performance printed circuit board fabrication & assembly, semiconductor packaging, systems integration & test, advanced laboratory services and contract R&D. Our technology can be found in the world's fastest supercomputers, life-saving medical devices, complex imaging systems, mission-critical defense applications and thousands of other products, throughout the world.
May 14, 2015
“Plated through hole (PTH) lifetime predictor for Temperature Cycling (TC)”. The PTH is the basic building block of circuit interconnect, used in printed circuit boards (PCB) in products we all use every day. The lifetime of the printed circuit board and your product is very dependent on how long the PTH will last. The PTH reliability is dependent on several variables such as the thickness of the board, the quality and plating in the hole, the thickness of the plating as well as connection interface between the in inner layer and the PTH.
February 19, 2015
The High Density Packaging (HDP) User Group headquartered in the United States announces that its High Frequency Test Project Team has won best technical paper at IPC APEX EXPO. This prestigious honor is given to one paper each year, selected from all of the papers presented at the symposium. Voted on through a ballot process by members of IPC's Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 24.
October 23, 2014
The High Density Packaging (HDP) User Group headquartered in the United States announces the Smooth Copper Signal Integrity project which is focused on evaluating the effects of processing smooth copper foil for Printed Circuit Boards (PCBs) and the roughness on all sides of a trace produced when the circuits are fabricated. It will also evaluate the variation caused by etch chemistry/oxide chemistry and just as critical, the methods of roughness measurement.
January 13, 2014
The organization was founded in 1993 and has been in continuous operation since then. The foundation of HDP User Group is multi-company cooperation on technical issues of common concern to its members such as characterization of new packaging concepts with respect to reliability and technical performance.
January 6, 2014
Polar Instruments is a provider of signal integrity tools and high-speed test equipment and services. Headquartered in Great Britain, Polar Instruments has a 40+ year history of providing advance design, test, and repair technology to the electronics industry.
May 8, 2013
Concerns over the potential release of harmful by products from electronic products containing halogenated flame retardant (HFRs) when those products are improperly disposed of, has led many of the major global computer manufacturers to begin phasing out HFRs, including bromine, chlorine and materials containing these elements, such as Poly Vinyl Chloride (PVC). HDP User Group members are proactively looking for replacements for these materials in cables which are used in all electronics hardware. In the first Halogen Free Cables Project, HDP User Group completed a study that compared technical performance of HFR-free replacement materials that could be used in cable products.
May 1, 2013
EMC is committed to developing innovative Printed Circuit Board (PCB) base materials with its halogen-free technology which are in line with future market demand and customer requirements, such as ultra-thin core, ultra high thermal conductivity material, IC substrate base material and mid loss, low loss and ultra-low loss high speed materials.
March 19, 2013
Kyzen Corporation was founded in 1990. Kyzen was among the first to invent novel and environmentally friendly cleaning technologies to replace CFC’s and other ozone depleting chemicals. These cleaning technologies are derived from renewable resources and offer an innovative and environmentally friendly cleaning solution to the Electronics, Semiconductor, Optics and Metal Finishing markets.
March 6, 2013
Sekisui Chemical Co., Ltd. is a premier materials supplier to the global LCD and Semiconductor, markets. Sekisui has developed and markets a plastic core solder ball known as Micropearl SOL, which is widely used in various package applications. Other products include solder materials, conductive fine particles, intermediate films for laminated glass, foamed polyolefin, double-faced tapes, industrial resins and films, optical films, inspection chemicals, medical equipment, packing tapes, adhesives and plastic containers.
January 2, 2013
Indium Corporation manufactures materials for package-on-package, flip-chip, 2.5D and 3D semiconductor assembly, and advanced SMT assembly processes, including semiconductor grade fluxes and solder paste, die-attach wire, and specialty solder spheres.