High Density Packaging User Group (HDP) is pleased to announce that Japan Pure Chemical Co., Ltd. (JPC)has become a member.
“JPC engages in final finish technologies for PCBs, PKGs, connectors, lead frames, and wafers with our original plating chemical technologies, especially noble metals such as gold, palladium, and silver, to become a linking bridge between chemicals and electronics. We are excited to work with HDP members and contribute to elevating PCBs and packaging technologies facing the new demands from epoch-making 5G and beyond.”, said Kenichi SHIMODA, General Manager, Marketing Division.
“I am pleased to welcome JPC to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in surface treatments for high performance electronics, especially those focused on next-generation servers and networking products, will contribute significantly to several of our emerging technology projects”, said Larry Marcanti, Executive Director of HDP User Group.
Since its founding in 1971, JPC has been developing, manufacturing, and selling gold plating chemicals, silver plating chemicals, and palladium plating chemicals for semiconductor packages and connectors by focusing on the electronics field as our primary business domain. JPC has been amassing technologies over many years through our proprietary research and development system.
Visit JPC at https://www.netjpc.com/english/