Name: Sequential Lamination
Start: 2025-07-09T11:00:00-05:00
End: 2025-07-09T12:00:00-05:00

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7 events found.

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No events scheduled for July 6, 2025.

No events scheduled for July 7, 2025.

8:00 am

July 8 @ 8:00 am - 9:00 am

Stacked vs. Staggered Microvias

9:00 am

July 9 @ 9:00 am - 10:00 am

D-Coupon IST CITC Reliability Testing

9:00 am

July 10 @ 9:00 am - 10:00 am

Reflow Cycle Via Reliability Impact SMTAi Paper Review

10:00 am

July 10 @ 10:00 am - 11:00 am

TCE Materials-Test Method Validation

No events scheduled for July 11, 2025.

No events scheduled for July 12, 2025.

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Sun 6

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Wed 9

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12:00 am1:00 am2:00 am3:00 am4:00 am5:00 am6:00 am7:00 am8:00 am9:00 am10:00 am11:00 am12:00 pm1:00 pm2:00 pm3:00 pm4:00 pm5:00 pm6:00 pm7:00 pm8:00 pm9:00 pm10:00 pm11:00 pm12:00 am

8:00 am - 9:00 am

HDP Staff Call

July 8 @ 8:00 am - 9:00 am

Stacked vs. Staggered Microvias

July 8 @ 10:00 am - 11:00 am

Stacked vs. Staggered Microvias

Meeting

9:00 am - 10:00 am

tCAF Eq

July 9 @ 9:00 am - 10:00 am

tCAF Eq

Results of limited FA Data analysis update Start of report writing

11:00 am - 12:00 pm

Sequential Lamination

July 9 @ 11:00 am - 12:00 pm

Porosity

July 9 @ 6:00 pm - 7:00 pm

Porosity

Progress on action items

8:00 am - 9:00 am

D-Coupon IST CITC Reliability Testing

July 10 @ 8:00 am - 9:00 am

D-Coupon IST CITC Reliability Testing

9:00 am - 10:00 am

Reflow Cycle Via Reliability Impact SMTAi Paper Review

July 10 @ 9:00 am - 10:00 am

Reflow Cycle Via Reliability Impact SMTAi Paper Review

10:00 am - 11:00 am

Materials #7 meeting

July 10 @ 10:00 am - 11:00 am

TCE Materials-Test Method Validation

July 10 @ 11:00 am - 12:00 pm

TCE Materials-Test Method Validation

Validate and recommend new and standard TM for CTE using TMA.

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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