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No events scheduled for May 3, 2026.

10:00 am

May 4 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency Phase 2 and 3

12:00 pm

May 5 @ 12:00 pm - 1:00 pm

Harsh Use Alloy Evaluations Project Call

2:00 pm

May 5 @ 2:00 pm - 3:00 pm

Effect of Metal Additions on Solder Joint Reliability Project Call

10:00 am

May 6 @ 10:00 am - 11:00 am

D-Coupon IST CITC Reliability Testing

4:00 pm

May 7 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

No events scheduled for May 8, 2026.

No events scheduled for May 9, 2026.

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12:00 am1:00 am2:00 am3:00 am4:00 am5:00 am6:00 am7:00 am8:00 am9:00 am10:00 am11:00 am12:00 pm1:00 pm2:00 pm3:00 pm4:00 pm5:00 pm6:00 pm7:00 pm8:00 pm9:00 pm10:00 pm11:00 pm12:00 am

10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency Phase 2 and 3

May 4 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency Phase 2 and 3

12:00 pm - 1:00 pm

Harsh Use Alloy Evaluations Project Call

May 5 @ 12:00 pm - 1:00 pm

Harsh Use Alloy Evaluations Project Call

Periodic Project Call

2:00 pm - 3:00 pm

Effect of Metal Additions on Solder Joint Reliability Project Call

May 5 @ 2:00 pm - 3:00 pm

Effect of Metal Additions on Solder Joint Reliability Project Call

Periodic Project Call

10:00 am - 11:00 am

SIR Testing meeting

May 6 @ 10:00 am - 11:00 am

D-Coupon IST CITC Reliability Testing

May 7 @ 10:00 am - 11:00 am

D-Coupon IST CITC Reliability Testing

Project WebEx Meeting Call

4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

May 7 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

Export Events

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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