Name: Thin Dielectric Skew Project
Start: 2026-04-08T11:00:00-05:00
End: 2026-04-08T12:00:00-05:00

Have any questions?
info@hdpug.org

PROJECTS
MEMBERSHIP
EVENTS
- Calendar
- Member Meetings

7 events found.

Events Search and Views Navigation

Enter Keyword. Search for Events by Keyword.

Event Views Navigation

This Week

Select date.

View by:

Month
Week
Day

Previous week
Next week

No events scheduled for March 29, 2026.

No events scheduled for March 30, 2026.

10:00 am

March 31 @ 10:00 am - 11:00 am

Project Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability

10:00 am

April 1 @ 10:00 am - 11:00 am

Inner Layer Copper Balancing 2

3:00 pm

April 1 @ 3:00 pm - 4:00 pm

Correlating CF Profile to Signal Integrity Project Call

April 1 @ 8:00 pm - 9:00 pm

Correlating CF Profile to Signal Integrity Project Call

10:00 am

April 2 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

4:00 pm

April 2 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

7:00 pm

April 2 @ 7:00 pm - 8:00 pm

Porosity

No events scheduled for April 3, 2026.

No events scheduled for April 4, 2026.

Previous
This Week
Next

Week of Events

Sun 29

Mon 30

Tue 31

Wed 1

Thu 2

Fri 3

Sat 4

12:00 am1:00 am2:00 am3:00 am4:00 am5:00 am6:00 am7:00 am8:00 am9:00 am10:00 am11:00 am12:00 pm1:00 pm2:00 pm3:00 pm4:00 pm5:00 pm6:00 pm7:00 pm8:00 pm9:00 pm10:00 pm11:00 pm12:00 am

10:00 am - 11:00 am

SIR Testing meeting

March 31 @ 10:00 am - 11:00 am

Project Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability

March 31 @ 2:00 pm - 3:00 pm

Project Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability

Kickoff Call: Effect of Metal Additions from Final Finishes on Solder Joint Reliability

10:00 am - 11:00 am

Inner Layer Copper Balancing 2

April 1 @ 10:00 am - 11:00 am

Inner Layer Copper Balancing 2

Project Meeting

3:00 pm - 4:00 pm

Cu Outer Trace Adhesion

April 1 @ 3:00 pm - 4:00 pm

Correlating CF Profile to Signal Integrity Project Call

April 1 @ 8:00 pm - 9:00 pm

Correlating CF Profile to Signal Integrity Project Call

8:00 pm - 9:00 pm

Correlating CF Profile to Signal Integrity Project Call

April 1 @ 8:00 pm - 9:00 pm

Correlating CF Profile to Signal Integrity Project Call

10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

April 2 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

Meeting

4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

April 2 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

*Due to an urgent matter involving the leader (Rich DePoto), the schedule has been changed to March 26–April 2.

7:00 pm - 8:00 pm

Porosity

April 2 @ 7:00 pm - 8:00 pm

Porosity

Any last minute changes to BoD application for Phase 2 Next final report draft

Export Events

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

About

About Us
Staff Directory
Annual Reports

Information

Member List
News Releases
FAQs
Brand Guide

Policies

Operating Procedures
Bylaws
Terms and Conditions
Privacy Policy