Name: Investigate New Test Methods for Copper Foil Adhesion Project Call
Start: 2026-04-30T09:00:00-05:00
End: 2026-04-30T10:00:00-05:00

10:00 am

April 28 @ 10:00 am - 11:00 am

Stacked Microvia Capability Improvement

12:00 pm

April 28 @ 12:00 pm - 1:00 pm

Paste Interconnect Exploratory Meeting

9:00 am

April 30 @ 9:00 am - 10:00 am

Investigate New Test Methods for Copper Foil Adhesion Project Call

10:00 am

April 30 @ 10:00 am - 11:00 am

Thin Dielectric Skew Project

11:00 am

April 30 @ 11:00 am - 12:00 pm

Sequential Lamination Meeting

12:00 pm

April 30 @ 12:00 pm - 1:00 pm

Better CAF Equation

3:00 pm

April 30 @ 3:00 pm - 4:00 pm

Cu Outer Trace Adhesion

Export Events

Stacked Microvia Capability Improvement

Paste Interconnect Exploratory Meeting

Pb Free Materials 7 Project Call

Investigate New Test Methods for Copper Foil Adhesion Project Call

Thin Dielectric Skew Project

Sequential Lamination Meeting

Better CAF Equation

Cu Outer Trace Adhesion

Stacked Microvia Capability Improvement

Paste Interconnect Exploratory Meeting

Pb Free Materials 7 Project Call

Investigate New Test Methods for Copper Foil Adhesion Project Call

Thin Dielectric Skew Project

Sequential Lamination Meeting

Better CAF Equation

Cu Outer Trace Adhesion

Week of Events

Sun 26

Mon 27

Tue 28

Wed 29

Thu 30

Fri 1

Sat 2

Stacked Microvia Capability Improvement

Paste Interconnect Exploratory Meeting

Pb Free Materials 7 Project Call

Investigate New Test Methods for Copper Foil Adhesion Project Call

Thin Dielectric Skew Project

Sequential Lamination Meeting

Better CAF Equation

Cu Outer Trace Adhesion