Meeting

Call with BW Wanda Plus Grand Hotel on AV setup

Project Meeting

Meeting

Correlating CF Profile to Signal Integrity Project Call

Meeting

Discussion new idea project for Thermal Cooling Methods. New Project Idea Call “Cooling Methods for Heat Dissipation” There are significant challenges introduced by advanced packaging in terms of...

Meeting

New Project Idea Call   High Aspect Ratio Through Hole Limits With AI, High Performance Computing, Data Centers, ADAS among other technologies, layer counts are increasing. In addition, aspect ratios of...

Look at last round of FA Work on final report

Review final report and DATA