Name: Correlating CF Properties With Signal Integrity Project Call
Start: 2026-11-04T19:00:00-06:00
End: 2026-11-04T20:00:00-06:00

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No events scheduled for November 1, 2026.

10:00 am

November 2 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

8:00 am

November 3 @ 8:00 am - 9:00 am

HDP Weekly Staff call

10:00 am

November 4 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

7:00 pm

November 4 @ 7:00 pm - 8:00 pm

Correlating CF Properties With Signal Integrity Project Call

9:00 am

November 5 @ 9:00 am - 10:00 am

Electrochemical Migration Phase 4

4:00 pm

November 5 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

No events scheduled for November 6, 2026.

No events scheduled for November 7, 2026.

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10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

November 2 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

8:00 am - 9:00 am

HDP Weekly Staff call

November 3 @ 8:00 am - 9:00 am

PCB Flatness at Lg Package Attach

November 4 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

Meeting

7:00 pm - 8:00 pm

Correlating CF Properties With Signal Integrity Project Call

November 4 @ 7:00 pm - 8:00 pm

Correlating CF Properties With Signal Integrity Project Call

9:00 am - 10:00 am

Electrochemical Migration Phase 4

November 5 @ 9:00 am - 10:00 am

Electrochemical Migration Phase 4

Meeting

4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

November 5 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

Export Events

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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