Name: Stacked Microvia Capability Improvement
Start: 2026-09-15T10:00:00-05:00
End: 2026-09-15T11:00:00-05:00

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No events scheduled for September 13, 2026.

10:00 am

September 14 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

8:00 pm

September 14 @ 8:00 pm - 9:00 pm

Large Component PWB Warpage Project Call

8:00 am

September 15 @ 8:00 am - 9:00 am

HDP Weekly Staff call

10:00 am

September 15 @ 10:00 am - 11:00 am

Stacked Microvia Capability Improvement

10:00 am

September 16 @ 10:00 am - 11:00 am

SIR Testing meeting

10:00 am

September 17 @ 10:00 am - 11:00 am

Glass Substrate Reliability Analysis

No events scheduled for September 18, 2026.

No events scheduled for September 19, 2026.

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Sun 13

Mon 14

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Wed 16

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Sat 19

12:00 am1:00 am2:00 am3:00 am4:00 am5:00 am6:00 am7:00 am8:00 am9:00 am10:00 am11:00 am12:00 pm1:00 pm2:00 pm3:00 pm4:00 pm5:00 pm6:00 pm7:00 pm8:00 pm9:00 pm10:00 pm11:00 pm12:00 am

10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

September 14 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

Postponed by one week due to the Labor Day holiday.

8:00 pm - 9:00 pm

Large Component PWB Warpage Project Call

September 14 @ 8:00 pm - 9:00 pm

Large Component PWB Warpage Project Call

8:00 am - 9:00 am

HDP Weekly Staff call

September 15 @ 8:00 am - 9:00 am

Stacked Microvia Capability Improvement

September 15 @ 10:00 am - 11:00 am

Stacked Microvia Capability Improvement

Meeting

10:00 am - 11:00 am

SIR Testing meeting

September 16 @ 10:00 am - 11:00 am

Sequential Lamination Meeting

September 17 @ 10:00 am - 11:00 am

Glass Substrate Reliability Analysis

September 17 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

Export Events

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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