Events for week of August 30, 2026 – HDP User Group

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7 events found.

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No events scheduled for August 30, 2026.

8:00 pm

August 31 @ 8:00 pm - 9:00 pm

Large Component PWB Warpage Project Call

10:00 am

September 1 @ 10:00 am - 11:00 am

Stacked Microvia Capability Improvement

12:00 pm

September 1 @ 12:00 pm - 1:00 pm

Harsh Use Alloy Evaluations Project Call

9:00 am

September 2 @ 9:00 am - 10:00 am

Thin Dielectric Skew Project WebEx Call

1:00 pm

September 2 @ 1:00 pm - 2:00 pm

High Aspect Ratio Plating Limits

8:00 pm

September 2 @ 8:00 pm - 9:00 pm

Correlating CF Profile to SI Next Phase Project Call

11:00 am

September 3 @ 11:00 am - 12:00 pm

Sequential Lamination Meeting

No events scheduled for September 4, 2026.

No events scheduled for September 5, 2026.

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Week of Events

Sun 30

Mon 31

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12:00 am1:00 am2:00 am3:00 am4:00 am5:00 am6:00 am7:00 am8:00 am9:00 am10:00 am11:00 am12:00 pm1:00 pm2:00 pm3:00 pm4:00 pm5:00 pm6:00 pm7:00 pm8:00 pm9:00 pm10:00 pm11:00 pm12:00 am

8:00 pm - 9:00 pm

Large Component PWB Warpage Project Call

August 31 @ 8:00 pm - 9:00 pm

Large Component PWB Warpage Project Call

Large Component PWB Warpage Project Call

10:00 am - 11:00 am

Stacked Microvia Capability Improvement

September 1 @ 10:00 am - 11:00 am

Stacked Microvia Capability Improvement

Meeting

12:00 pm - 1:00 pm

Harsh Use Alloy Evaluations Project Call

September 1 @ 12:00 pm - 1:00 pm

Harsh Use Alloy Evaluations Project Call

Periodic Project Call

9:00 am - 10:00 am

Thin Dielectric Skew Project WebEx Call

September 2 @ 9:00 am - 10:00 am

Thin Dielectric Skew Project WebEx Call

Project Meeting

1:00 pm - 2:00 pm

High Aspect Ratio Plating Limits

September 2 @ 1:00 pm - 2:00 pm

High Aspect Ratio Plating Limits

with aspect ratios exceeding 30:1, what are the limitations to plating uniformity, throwing power and long-term reliability.

8:00 pm - 9:00 pm

Correlating CF Profile to SI Next Phase Project Call

September 2 @ 8:00 pm - 9:00 pm

Correlating CF Profile to SI Next Phase Project Call

Correlating CF Profile to SI Next Phase Project Call

11:00 am - 12:00 pm

Sequential Lamination Meeting

September 3 @ 11:00 am - 12:00 pm

Sequential Lamination Meeting

Meeting

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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