Name: Large Component PWB Warpage Project Kick-off Meeting
Start: 2026-06-16T21:00:00-05:00
End: 2026-06-16T22:00:00-05:00

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No events scheduled for June 14, 2026.

10:00 am

June 15 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

9:00 am

June 16 @ 9:00 am - 10:00 am

D-Coupon IST CITC Reliability Testing

12:00 pm

June 16 @ 12:00 pm - 1:00 pm

Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call

9:00 pm

June 16 @ 9:00 pm - 10:00 pm

Large Component PWB Warpage Project Kick-off Meeting

9:00 am

June 17 @ 9:00 am - 10:00 am

Pb Free Materials 7 Project Ca

3:00 pm

June 17 @ 3:00 pm - 4:00 pm

Copper Outer Layer Trace Adhesion

10:00 am

June 18 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

4:00 pm

June 18 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

No events scheduled for June 19, 2026.

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10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

June 15 @ 10:00 am - 11:00 am

Final Finish Layer Deposits for High Frequency, Phase 2 and 3

9:00 am - 10:00 am

D-Coupon IST CITC Reliability Testing

June 16 @ 9:00 am - 10:00 am

D-Coupon IST CITC Reliability Testing

Project Meeting

12:00 pm - 1:00 pm

Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call

June 16 @ 12:00 pm - 1:00 pm

Effect of Metal Additions from Final Finishes on Solder Joint Reliability Project Call

Periodic Project Call

9:00 pm - 10:00 pm

Large Component PWB Warpage Project Kick-off Meeting

June 16 @ 9:00 pm - 10:00 pm

Large Component PWB Warpage Project Kick-off Meeting

9:00 am - 10:00 am

Better CAF Equation

June 17 @ 9:00 am - 10:00 am

Pb Free Materials 7 Project Ca

June 17 @ 10:00 am - 11:00 am

Pb Free Materials 7 Project Ca

Meeting

3:00 pm - 4:00 pm

Copper Outer Layer Trace Adhesion

June 17 @ 3:00 pm - 4:00 pm

Copper Outer Layer Trace Adhesion

Copper out trace adhesion method

10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

June 18 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

Meeting

4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

June 18 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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