Name: Final Finish Layer Deposits for High Frequency, Phase 2 and 3
Start: 2026-02-16T10:00:00-06:00
End: 2026-02-16T11:00:00-06:00

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7 events found.

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No events scheduled for February 8, 2026.

No events scheduled for February 9, 2026.

8:00 am

February 10 @ 8:00 am - 9:00 am

HDP Weekly Staff call

10:00 am

February 10 @ 10:00 am - 11:00 am

Microvia Electrical Performance

12:00 pm

February 10 @ 12:30 pm - 1:30 pm

Foxconn HDP Introductory Meeting

9:00 am

February 11 @ 9:00 am - 10:00 am

Better CAF Eq

11:00 am

February 11 @ 11:00 am - 12:00 pm

Investigate New Test Methods for Copper Foil Adhesion Project Call

8:00 am

February 12 @ 8:00 am - 9:00 am

ECM-4

10:00 am

February 12 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

4:00 pm

February 12 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

No events scheduled for February 13, 2026.

No events scheduled for February 14, 2026.

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8:00 am - 9:00 am

HDP Weekly Staff call

February 10 @ 8:00 am - 9:00 am

Microvia Electrical Performance

February 10 @ 10:00 am - 11:00 am

Microvia Electrical Performance

Meeting

12:30 pm - 1:30 pm

Marshall Kim Testing Call

February 10 @ 12:30 pm - 1:30 pm

Marshall Kim Testing Call

Kim and Marshall doing website testing

6:00 pm - 7:00 pm

Porosity Testing

February 10 @ 6:00 pm - 7:00 pm

Porosity Testing

JPC's latest X-ray results - one board, all 8 sections Joe's progress on final report

8:00 pm - 9:00 pm

Foxconn HDP Introductory Meeting

February 10 @ 8:00 pm - 9:00 pm

Foxconn HDP Introductory Meeting

9:00 am - 10:00 am

Better CAF Eq

February 11 @ 9:00 am - 10:00 am

Sequential Lamination Meeting

February 11 @ 11:00 am - 12:00 pm

Investigate New Test Methods for Copper Foil Adhesion Project Call

February 11 @ 7:00 pm - 8:00 pm

Investigate New Test Methods for Copper Foil Adhesion Project Call

8:00 am - 9:00 am

ECM-4

February 12 @ 8:00 am - 9:00 am

PCB Flatness at Lg Package Attach

February 12 @ 10:00 am - 11:00 am

PCB Flatness at Lg Package Attach

Meeting

4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

February 12 @ 4:00 pm - 5:00 pm

Glass Substrate Reliability Analysis

Export Events

The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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