Name: Investigate New Test Methods for Copper Foil Adhesion Project Call
Start: 2025-07-02T19:00:00-05:00
End: 2025-07-02T20:00:00-05:00

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Final Finish Layer Deposits for High Frequency

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Harsh Use Alloy Evaluations Project Call

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Investigate New Test Methods for Copper Foil Adhesion Project Call

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Final Finish Layer Deposits for High Frequency

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Final Finish Layer Deposits for High Frequency

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Harsh Use Alloy Evaluations Project Call

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Harsh Use Alloy Evaluations Project Call

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Investigate New Test Methods for Copper Foil Adhesion Project Call

July 2 @ 7:00 pm - 8:00 pm

Investigate New Test Methods for Copper Foil Adhesion Project Call

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The mission of HDP User Group International Inc., is to drive innovations in the Electronics Industry reducing cost and time to market through active collaborations that solve critical and emerging problems for the benefit of the membership

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